Two-Component Waterproof Thermal Conductive Silicone Potting Compound for Electronic Encapsulation and Sealing

Two-Component Thermal Conductive AB Potting Adhesive for Waterproof Electronic Sealing

Hanast HN-8806A/B is a two-component addition-cure silicone potting adhesive that cures at room temperature or under heat to a grey, 45 ± 5 Shore A elastomer with thermal conductivity of 0.76 W/m·K or above. It is used where potting has to do two jobs at once: keep water, humidity and dust out of the electronics, and conduct heat away from the device. The cured elastomer bonds to metal, aluminium, PC and acrylic surfaces, releases no heat and no by-products during cure, does not corrode sealed components and stays flexible from -50 °C to 250 °C, so sealed housings survive thermal cycling and outdoor service.

Key Features

• Waterproof and Moisture Proof Sealing - fills the whole cavity rather than coating the surface, so water ingress paths through connectors and lead exits are blocked.
• Adhesion to Metal and Plastics - bonds to aluminium, iron, PC and acrylic housings, improving sealing performance and reducing the need for a separate primer.
• Thermal Conductivity 0.76 W/m·K or Above - conducts heat from the encapsulated device to the housing instead of insulating it.
• Non-Corrosive to Sealed Components - no heat and no by-product release during cure and near-zero shrinkage, so copper, plated leads and solder joints are not attacked or stressed.
• Wide Service Range -50 °C to 250 °C - keeps elasticity through cold-chain transport, outdoor cabinets and high-temperature operation.
• UL 94 V-0 Flame Retardancy - flame retardant encapsulation for consumer, industrial and automotive equipment.
• Electrical Insulation 1.0 × 10¹⁶ Ω·cm, 25-30 kV/mm - protects encapsulated circuits from short circuits and creepage.
• Deep-Section Curing - cures through thick sections for transformer and power module cavities without voids.
• 1:1 Mix Ratio, 18-24 min Pot Life, 12 min at 80 °C - practical for manual potting and for heat-accelerated production lines.

Technical Specifications (HN-8806A/B)

Typical Applications

• Waterproof encapsulation - outdoor electronic enclosure, control box, meter and junction box potting against rain, humidity and condensation.
• LED and driver sealing - LED outdoor driver, street light module and display module potting.
• Sensors and probes - temperature, pressure, level and flow sensor encapsulation in wet or washdown environments.
• Power and charging equipment - adapter, EV charger, inverter and power supply sealing with heat conduction.
• Transformers and coils - ignition coil, high-voltage transformer and inductor potting.
• Automotive electronics - ECU, sensor and connector potting where vibration, splash and thermal cycling apply.
• Sealant and bonding - gap filling and structural bonding of electronic assemblies to metal or plastic housings.

Mixing and Potting Process

1. Pre-mix: stir Components A and B separately before use, because fillers settle during storage; reseal containers tightly after use.
2. Weighing: weigh A and B at exactly 1:1 by weight on a precision electronic scale.
3. Mixing: mix in one direction for a uniform blend and scrape the container walls and bottom; uneven mixing causes local incomplete cure.
4. Degassing (optional): vacuum degas for void-sensitive devices to remove air introduced during mixing.
5. Pouring / potting: pour into the clean, dry device within the 18-24 min pot life and ensure full coverage of the component.
6. Curing: cure 2-3 h at 25 °C, or 12 min at 80 °C for heat-accelerated lines; do not move or stress the part during cure.

Cure Inhibition and Sealing Precautions

• This addition-cure silicone may fail to cure in contact with organotin and tin-containing silicones, sulfur and polysulfide compounds, amines, polyurethane rubber, ammonia-containing items, phosphorus compounds, organic acids and solder flux residues - clean and dry all surfaces and remove flux before sealing.
• Do not use in contact with condensation-cure (acetoxy) silicone, epoxy or polyurethane, which cause cure inhibition at the interface.
• Pot within the 18-24 min pot life and ensure full coverage of connectors and lead exits, since incomplete filling leaves water paths.
• Use nitrile gloves, goggles and adequate ventilation; keep containers sealed and store away from food and incompatible materials.

Packaging, Storage and Shelf Life

• Component A: 25 kg plastic barrel; Component B: 25 kg plastic barrel; kit 50 kg per set.
• Store in original tightly sealed containers in a cool, dry, well-ventilated area at a recommended 25 °C, protected from direct sunlight, moisture and extreme temperatures.
• Shelf life 6 months from date of manufacture when stored as recommended; inspect and test material past shelf life before use.
• Classified as non-dangerous goods for transport; handle with care to prevent leakage.

Frequently Asked Questions

About Hanast

Shenzhen Hanast New Materials Co., Ltd. manufactures liquid silicone materials at a production base in Guangdong, China, supplying addition-cure (platinum) and condensation-cure silicone for electronic potting, thermal management and mould making. Every lot ships with TDS and MSDS documentation and is compliant with RoHS and UL 94 V-0 requirements.