Two Component Epoxy Resin Potting Glue 5:1 High Hardness Electronic Potting Glue Flow Gel
Description of Epoxy Potting Compound
Epoxy potting compounds refer to a class of liquid epoxy-based encapsulation or potting materials formulated with epoxy resin as the primary component, supplemented by various functional additives and an appropriate curing agent.
technical parameter of epoxy potting compound:
| efore curing |
builder |
Epoxy resin 5508 |
Curing agent 5508 |
| pigment |
Black / White et al |
Ruburn / transparent surface |
| |
A sticky epoxy resin water |
r liquid specific |
| c gravity, g / cm3 |
1.4-1.5 |
1.05 |
| Viscosity of 25℃ |
4,500—6,000cp s |
150—250cp storage |
| e Period (25℃) |
Six months |
x months |
|
processabili
|
mixing ratio |
A: B =5:1 (weight ratio) |
| Available for a time of 25℃ |
2-3H (100g mix) |
| curing time |
25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H |
| After curing |
2 Tensile strength of kg/cm |
16-18 |
| 2 Compressive strength of kg/cm |
18-22 |
| Resistance to the voltage of kv/mm |
20-22 |
| Surface resistance ofΩ-cm |
14
1.2*10
|
| Volume resistance ofΩ-cm |
15
1.1*10
|
| contraction percentage% |
0.35-0.55 |
| Water absorption rate was 25℃ * 24H |
<0.03% |
| The hardness of SHORE A |
85-95 |
|
distortion
temperature ℃
|
130-150 |
| low temperature resistant ℃ |
-30 |
Product Features of epoxy potting compound:
This product is an eco-friendly, flame-retardant, two-part (AB) epoxy potting compound. It features low viscosity, excellent fluidity, and superior penetrability, allowing it to easily flow into the intricate gaps of a product; it also exhibits excellent heat dissipation properties. The material can be cured at either room temperature or moderate temperatures, with a curing rate that is neither too fast nor too slow. Once cured, the material is bubble-free, presenting a smooth, glossy surface with high hardness. The cured product demonstrates excellent resistance to acids and alkalis, as well as outstanding protection against moisture, water, and dust; it also withstands humid heat and atmospheric aging. Furthermore, the cured material possesses superior physical characteristics, including excellent electrical insulation, high compressive strength, and strong adhesive bonding strength.
Application of epoxy resin potting:
Electronic component encapsulation, such as for integrated circuits (ICs), power modules, and sensors.
Optical device encapsulation, used to fix and protect components such as lenses and optical chips.
Thanks to its excellent insulating properties, epoxy potting compound often serves as an ideal choice for power equipment encapsulation.
Widely used in automotive electronics for packaging components like electronic control modules and sensors, its high strength and high-temperature
resistance meet the rigorous demands of automotive operating environments.
Widely applied for the insulation potting and moisture-proof encapsulation of various electronic components, such as electronic transformers, negative ion generators, power modules, high-voltage packs, aquarium pumps, relays, capacitors (including vertical, horizontal, box-type, and film capacitors), ignition coils, instrument transformers, AC/DC modules, LEDs, LED modules, AC capacitors, lighting fixtures, electrical appliances, and more.
How to use epoxy potting compound:
Manual Potting
As the name implies, manual potting is a completely hands-on process covering mixing, degassing, and dispensing. The standard procedure begins with pre-stirring components A and B individually to ensure uniformity. Next, the components are weighed according to the specified mix ratio, combined, and thoroughly agitated until completely homogeneous. The mixture is then placed in a vacuum chamber for 5–10 minutes to eliminate air bubbles. Finally, the degassed compound is manually dispensed onto the designated areas of the electronic components.
Mechanical Potting
Mechanical potting relies on automated machinery to execute the entire encapsulation process. Operation begins by calibrating the potting system and programming the specific dispensing parameters. The compound is then loaded into the machine's dedicated material tanks, while the target workpieces are secured in appropriate fixtures. Once activated, the machine executes the pre-configured program to complete the automated dispensing process.
Package of epoxy potting compound:
25kg/barrel
sample package:1kg/6kg
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