High Transparency Epoxy Potting Compound For Electronics 2:1 Self-Leveling AB Glue, Ideal For LED Modules, Sensitive Components & High Voltage Insulation
Description of Epoxy Potting Compound
The 2:1 Transparent Epoxy Potting Compound is a two-component epoxy resin encapsulation material designed to be mixed at a weight ratio of 2:1 (Part A:Part B). Characterized by its complete transparency, high hardness upon curing, and excellent insulating properties, it is specifically engineered to provide moisture-proof, waterproof, sealing, and confidentiality protection for electronic components.
![]()
technical parameter of epoxy potting compound:
Model: HN-5506A/B
Color:Transparent
Protective Performance: Upon curing, it forms a robust protective layer
that is moisture-proof, waterproof, shock-resistant, and resistant to chemical corrosion.
Curing time (25℃):12-24H
Hardness (shore D):70-75
Thermal conductivity
(w/m.k):0.2-0.3
Temperature resistance(℃):-40-120℃
![]()
Product Features of epoxy potting compound:
Mixing Ratio: The recommended mixing ratio of the main agent to the curing agent is 2:1 (typically based on weight). Optical Clarity: Maintains high transparency and light transmittance after curing, making it ideal for applications with strict aesthetic requirements or those requiring light transmission. Electrical Insulation: Possesses excellent electrical insulation properties, effectively preventing current leakage and short circuits. Protective Performance: Forms a robust protective layer upon curing, offering resistance to moisture, water, vibration, and chemical corrosion.
![]()
![]()
Application of epoxy resin potting:
Electronic Packaging: Used for the insulating casting and potting of transformers, capacitors, and LED modules. Decorative Crafts: Characterized by high transparency and excellent surface gloss, it is frequently utilized as a casting resin for crafting handmade items or as a protective surface coating for rigid decorative objects. Product Confidentiality: Due to its hard texture and resistance to disassembly once cured, it is commonly employed to provide security and tamper-proof protection for circuit boards requiring protection against reverse engineering or unauthorized access.
![]()