Odm Clear Potting Epoxy 5:1 Vulcanizing Potting Epoxy For Transformer Led Driver Power Supply

Odm Clear Potting Epoxy 5:1 Vulcanizing Potting Epoxy For Transformer Led Driver Power Supply

Description of Epoxy Potting Compound

5:1 Black Epoxy Potting Compound refers to a two-component epoxy encapsulation material that is black in color, cures at room temperature or under heat, and features a mixing weight ratio of 5:1 between the resin (Component A) and the curing agent (Component B).

technical parameter of epoxy potting compound:

Product Features of epoxy potting compound:

1,High Hardness and Strong Adhesion
Once cured, the surface becomes extremely hard (typically exhibiting a Shore D hardness of >80), resembling rigid plastic. Simultaneously, it demonstrates exceptional bonding strength to various substrates—such as metals and plastics—adhering firmly to component surfaces without easily detaching or developing cracks.

2,Excellent Electrical Insulation Properties
This constitutes the most fundamental characteristic of a potting compound. It possesses high insulation resistance and dielectric strength, effectively isolating high-voltage circuits and preventing creepage, short circuits, and dielectric breakdown, thereby ensuring the stable operation of electronic components under high-voltage conditions.

3,Outstanding Environmental and Chemical Resistance

Water and Moisture Resistance:Upon curing, it forms a dense, impermeable barrier capable of achieving water resistance ratings of IP67 or even IP68.

Chemical Resistance: It withstands corrosion from dilute acids, alkalis, salt spray, solvents, and oils.

Temperature Resistance:It is capable of long-term operation within a temperature range of approximately -40°C to 150°C (with a heat distortion temperature of approximately 120°C), making it suitable for environments subject to drastic temperature fluctuations.

Effective Confidentiality and Structural Support

Opaque Black Finish:It completely conceals circuit traces, preventing reverse engineering (cloning) of the product and serving as a physical security measure to protect proprietary designs.

4,Structural Support:Once cured, it exhibits high mechanical strength, providing resistance against vibration and impact to protect delicate internal wires or solder joints from being severed or dislodged.

Application of epoxy resin potting:

1. Power Supplies and Power Modules
2. Automotive and Industrial Electronics
3. Component and Circuit Board Protection
4. Applications in Special Environments (e.g., Aquarium Pumps, LED Modules, and Lighting Fixtures)

Purchasing Guide and Important Considerations of epoxy potting compound:

When selecting and using this product, there are several key points that warrant your special attention:

Note on Mixing Ratios:The "5:1" ratio typically refers to a ratio by weight, not by volume. When preparing the mixture, it is essential to use an electronic scale for precise measurement; otherwise, the adhesive may fail to cure properly or may not meet performance specifications.

Limited Working Time:Once the two components are mixed, the chemical reaction begins immediately. Typically, at a room temperature of 25°C, you have approximately 30–40 minutes of working time (referred to in the industry as the "pot life"); the potting process must be completed within this timeframe.

Curing Time:Complete curing takes 24 hours at room temperature (25°C). If you are pressed for time, you can accelerate the curing process by baking the item at 60°C for approximately 2–3 hours; furthermore, the final performance characteristics are often enhanced when cured under heat.

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