Water Clear RTV Silicone Potting Compound 10:1 High Dielectric Strength For LED Module IP68 Waterproof Encapsulation

Water Clear RTV Silicone Potting Compound for LED Module Encapsulation

HN-8808 is a two-part 10:1 RTV silicone potting compound supplied as a water-clear flowing liquid. It cures at room temperature into a transparent, elastic protective layer with high dielectric strength (≥14 kV/mm), excellent electrical insulation resistance and reliable IP68 waterproof protection, making it a preferred encapsulant for LED drivers, LED modules, circuit boards, power modules and automotive electronic components.

Key Features

• Water Clear Transparency: Cured material stays optically clear for easy visual inspection of internal components and uniform LED light transmission.
• High Dielectric Strength: ≥14 kV/mm dielectric strength with volume resistivity ≥5.0*10^14 Ω·cm and low dielectric constant 2.5-3.0, providing reliable insulation for high-voltage electronics.
• IP68 Waterproof Protection: Forms a damp-proof, moisture-proof sealing layer that protects PCBs and modules from water, humidity and corrosion.
• Wide Temperature Range: Stable performance from -57°C to 250°C for demanding outdoor and automotive environments.
• Safe Curing Profile: 40-60 minutes operating time and 4-6 hours cure at 25°C; no heat release, non-corrosive, non-swelling and non-toxic.
• Strong Adhesion: Bonds firmly to circuit boards, metal housings and electronic components without damaging sensitive parts.
• Simple 10:1 Mixing: Low-error mix ratio with good flowability for deep potting and fine filling of compact modules.
• Certified Materials: RoHS and SGS compliant, odorless and safe for production environments.

Typical Physical Properties

• Appearance: Water clear / transparent flowing liquid (Part A & Part B)
• Mix Ratio: A:B = 10:1 by weight
• Viscosity (25°C): Part A 2000 mPa·s; Part B 50 mPa·s
• Density: 1.40-1.42 g/cm³ after mixing
• Operating Time (25°C): 40-60 minutes
• Curing Time (25°C): 4-6 hours
• Hardness: 25 Shore A
• Dielectric Strength: ≥14 kV/mm
• Dielectric Constant (1 MHz): 2.5-3.0
• Volume Resistivity: ≥5.0*10^14 Ω·cm
• Thermal Conductivity: 0.1-0.20 W/m·K
• Temperature Range: -57°C to 250°C

Applications

• LED driver and LED module encapsulation
• Circuit board conformal potting and insulation coating
• Power module and switching power supply potting
• Automotive electronic module sealing
• General electronic component insulation and waterproofing

Packaging & Supply

Available in 25 kg/iron drum or A+B set packing with MSDS and TDS documentation. ODM and OEM services welcome. Contact our technical team for samples and specifications.