Low Outgassing Epoxy Potting Compound with Shore D 85-95 Hardness and 20-22 kV/mm Dielectric Strength for Hydrogen Fuel Cells

HANAST HN-5508 A/B Low Outgassing Black Epoxy Potting Compound for Hydrogen Fuel Cell, Vacuum Electronics and Power Module Encapsulation

HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compound engineered for vacuum electronics, new-energy power modules and other high-reliability applications. Mixed at a 5:1 ratio by weight, it flows with low viscosity and a long pot life, penetrates narrow gaps, and cures bubble-free into a smooth, glossy, high-hardness (Shore D 85-95) black encapsulant. Its low-void, vacuum-degassing-friendly formulation, low shrinkage and wide -30°C to 130-150°C service range make it a dependable choice for sealing and protecting hydrogen fuel cell components, power modules, sensors and other electronics.

Key Features

• Low outgassing, vacuum-degassing-friendly formulation for sealed and void-sensitive electronics
• 5:1 two-component epoxy system, room-temperature cure or 60-80°C accelerated cure
• High hardness Shore D 85-95 for rigid, impact-resistant component protection
• High dielectric strength of 20-22 kV/mm with volume resistivity of 1.1 x 10¹⁵ ohm.cm
• Low shrinkage (0.35-0.55%) and good resistance to thermal cycling for wide-temperature service
• Wide service range from -30°C to a 130-150°C heat distortion temperature
• Acid/alkali resistance, moisture proofing and humid-heat ageing resistance
• High compressive strength (18-22 kg/cm²) and high bonding strength
• Low viscosity and long pot life (2-3 h) for easy casting and narrow-gap penetration
• Cures to a bubble-free, smooth, glossy surface
• RoHS compliant and classified as non-dangerous goods for global shipment
• Custom OEM/ODM with free samples and wholesale bulk supply

Technical Specifications

Applications

HN-5508 A/B is widely used for potting and protection of high-reliability electronics: hydrogen fuel cell components, EV battery packs and BMS boards, onboard chargers, power supply modules, LED drivers, 5G base station power units, solar inverter modules and wind turbine converters; transformers, resistors, filters, temperature sensors, temperature controllers, industrial sensors and motor stators; high-voltage ignition coils, high-voltage packages, automotive ECU modules, downhole electronics, PCBs, aquarium and underwater equipment, negative-ion generators and ultrasonic atomizers. It is especially suited to sealed, vacuum and wide-temperature electronics that require low outgassing, insulation and long-term reliability.

Why Choose HN-5508 A/B

With high hardness, high dielectric strength and a low-void, vacuum-degassing-friendly cure, HN-5508 A/B is one of the best potting compounds for reliable electronics protection. Hanast is a direct manufacturer based in Shenzhen, Guangdong, China, with a dedicated R&D laboratory. We supply free samples and wholesale bulk epoxy encapsulant across Asia and worldwide at factory-direct pricing, and offer custom OEM/ODM formulation of colour, viscosity, pot life, hardness and cure speed to match your specific hydrogen fuel cell, power module or sensor design.

Packaging & Storage

Supplied as Component A (25 kg plastic barrel) and Component B (5 kg plastic pot), or as a ready 30 kg/set kit. Store in original, tightly sealed containers in a cool, dry, well-ventilated area at around 25°C, protected from direct sunlight, moisture and extreme temperatures. Shelf life is 6 months from date of manufacture. Classified as non-dangerous goods for transport.

About this supplier

Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.

We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation.

FAQ

Q1: What is HN-5508 A/B and which applications does it suit?
A1: HN-5508 A/B is a 5:1 two-component low outgassing black epoxy potting compound with high hardness (Shore D 85-95) and high dielectric strength, designed for hydrogen fuel cell components, power modules, transformers, sensors, EV battery packs and other high-reliability electronics.

Q2: What are the mix ratio and curing schedule?
A2: Mix Component A and Component B at a 5:1 ratio by weight. Pot life is 2-3 hours at 25°C (100 g mix); tack-free in 6-8 hours and fully cured in 12-16 hours at 25°C, or in 1.5-2 hours at 60-80°C when curing time needs to be optimized.

Q3: Is it suitable for vacuum and sealed electronics?
A3: Yes. Its low-void formulation can be vacuum-degassed to remove air for void-free potting, making it suitable for sealed, vacuum and void-sensitive electronics such as hydrogen fuel cell and power modules.

Q4: What are its electrical insulation and temperature performance?
A4: It offers high dielectric strength of 20-22 kV/mm and volume resistivity of 1.1 x 10¹⁵ ohm.cm, with a 130-150°C heat distortion temperature, -30°C low-temperature resistance and low shrinkage (0.35-0.55%) for good thermal cycling stability.

Q5: Do you offer samples and wholesale supply?
A5: Yes. We are a direct China manufacturer offering free samples and wholesale bulk supply at factory-direct pricing. MOQ is 1 kg in 25 kg (A) + 5 kg (B) 30 kg/set kits; samples ship in 3-5 working days and wholesale/bulk orders in 7-15 days.