High Reliability Electronics Grade Epoxy Potting Compound with Shore D 85-95 Hardness and Low Shrinkage 0.35-0.55%

HANAST HN-5508 A/B High Reliability Electronics Grade Epoxy Potting Compound for Power Module, Aerospace and Defense Electronics Protection

HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compound engineered for high-reliability, electronics-grade encapsulation. Mixed at a 5:1 ratio by weight, it flows with low viscosity and a long pot life, penetrates narrow gaps, and cures bubble-free into a smooth, glossy, high-hardness (Shore D 85-95) black encapsulant. With high dielectric strength, low shrinkage, low-void vacuum-degassing-friendly cure and a wide -30°C to 130-150°C service range, it is a dependable choice for protecting power modules, sensors and other electronics exposed to harsh, wide-temperature environments.

Key Features

• Electronics-grade formulation for high-reliability, long-life component protection
• Designed for harsh and wide-temperature environments (-30°C to 130-150°C)
• 5:1 two-component epoxy system, room-temperature cure or 60-80°C accelerated cure
• High hardness Shore D 85-95 for rigid, impact-resistant component protection
• High dielectric strength of 20-22 kV/mm with volume resistivity of 1.1 x 10¹⁵ ohm.cm
• Low outgassing, vacuum-degassing-friendly formulation for sealed electronics
• Low shrinkage (0.35-0.55%) and good resistance to thermal cycling
• Acid/alkali resistance, moisture proofing and humid-heat ageing resistance
• High compressive strength (18-22 kg/cm²) and high bonding strength
• Low viscosity and long pot life (2-3 h) for easy casting and narrow-gap penetration
• RoHS compliant and classified as non-dangerous goods for global shipment
• Custom OEM/ODM with free samples and wholesale bulk supply

Technical Specifications

Applications

HN-5508 A/B is widely used for potting and protection of high-reliability electronics: power supply modules, aerospace and defense electronic modules, automotive ECU modules, EV battery packs and BMS boards, onboard chargers, LED drivers, 5G base station power units, solar inverter modules, wind turbine converters and hydrogen fuel cell components; transformers, resistors, filters, temperature sensors, temperature controllers, industrial sensors and motor stators; high-voltage ignition coils, high-voltage packages, downhole electronics, PCBs, aquarium and underwater equipment, negative-ion generators and ultrasonic atomizers. It suits sealed, vacuum and harsh-environment electronics that require electronics-grade insulation and long-term reliability.

Why Choose HN-5508 A/B

With high hardness, high dielectric strength and a low-void, vacuum-degassing-friendly cure, HN-5508 A/B is one of the best potting compounds for reliable electronics protection. Hanast is a direct manufacturer based in Shenzhen, Guangdong, China, with a dedicated R&D laboratory. We supply free samples and wholesale bulk epoxy encapsulant across Asia and worldwide at factory-direct pricing, and offer custom OEM/ODM formulation of colour, viscosity, pot life, hardness and cure speed to match your specific power module, ECU or sensor design.

Packaging & Storage

Supplied as Component A (25 kg plastic barrel) and Component B (5 kg plastic pot), or as a ready 30 kg/set kit. Store in original, tightly sealed containers in a cool, dry, well-ventilated area at around 25°C, protected from direct sunlight, moisture and extreme temperatures. Shelf life is 6 months from date of manufacture. Classified as non-dangerous goods for transport.

About this supplier

Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.

We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation.

FAQ

Q1: What is HN-5508 A/B and which applications does it suit?
A1: HN-5508 A/B is a 5:1 two-component high reliability electronics grade epoxy potting compound with high hardness (Shore D 85-95) and high dielectric strength, designed for power modules, aerospace and defense electronics, automotive ECU modules, transformers, sensors and other high-reliability electronics.

Q2: Is it suitable for harsh and wide-temperature environments?
A2: Yes. It offers a 130-150°C heat distortion temperature, -30°C low-temperature resistance, acid/alkali and moisture resistance, and good thermal cycling stability, making it suitable for harsh, wide-temperature electronics.

Q3: What are the mix ratio and curing schedule?
A3: Mix Component A and Component B at a 5:1 ratio by weight. Pot life is 2-3 hours at 25°C (100 g mix); tack-free in 6-8 hours and fully cured in 12-16 hours at 25°C, or in 1.5-2 hours at 60-80°C when curing time needs to be optimized.

Q4: Can it be vacuum-degassed, and what is the insulation performance?
A4: Yes, it can be vacuum-degassed to remove air for void-free potting. It offers high dielectric strength of 20-22 kV/mm and volume resistivity of 1.1 x 10¹⁵ ohm.cm for reliable electrical insulation.

Q5: Do you offer samples, customization and wholesale supply?
A5: Yes. We are a direct China manufacturer offering free samples and wholesale bulk supply at factory-direct pricing, with custom OEM/ODM formulation of colour, viscosity, pot life, hardness and cure speed. MOQ is 1 kg in 25 kg (A) + 5 kg (B) 30 kg/set kits; samples ship in 3-5 working days and bulk orders in 7-15 days.