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High-Dimensional Stability Resin for Semiconductor Test Sockets and Fixtures

2026-03-24

Latest company case about High-Dimensional Stability Resin for Semiconductor Test Sockets and Fixtures

High-Dimensional Stability Resin for Semiconductor Test Sockets and Fixtures

 

This high-dimensional stability encapsulation resin prioritizes ultimate precision. Its near-zero curing shrinkage ensures that semiconductor test fixtures remain undeformed and stable during continuous high-temperature testing. High hardness and excellent insulation properties contribute to improved accuracy in the chip packaging and testing process.

 

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