Chemical Resistant Epoxy Potting Compound Excellent Sealing Property For Harsh Industrial Environment Modules

Chemical Resistant Epoxy Potting Compound Excellent Sealing Property For Harsh Industrial Environment Modules

Description of Epoxy Potting Compound

HN-5508 is a high-grade low-viscosity epoxy resin formulated for high-performance potting, encapsulation and sealing. It delivers stable curing at ambient or low temperatures and offers prolonged pot life paired with outstanding flowability. The liquid resin readily infiltrates narrow gaps, fine clearances and complex component structures while minimizing air entrapment.

Product Features of epoxy potting compound:

Application of epoxy resin potting:

HN-5508 serves high-performance potting & encapsulation needs for extensive electronic applications:

▪ Power & Inductive Components: Transformers, resistors, filters, ignition coils, high-voltage flyback transformers (high-voltage packs)

▪ Sensors & Controls: Temperature sensors, thermistors, temperature controllers and thermostats

▪ Submersible Aquatic Equipment: Aquarium supplies, water pumps, waterproof underwater electronics

▪ Specialized Electronics: Anion generators, ultrasonic atomizers and various sensitive electronic modules

How to use epoxy potting compound

Surface Preparation: Fully clean and dry all substrates.

Weighing & Mixing: Blend Part A and Part B strictly at a 5:1 weight ratio; stir thoroughly for 2–3 minutes.

Degassing: Perform vacuum degassing for 3–5 minutes to eliminate entrapped air bubbles.

Application & Curing: Pour slowly. Cure at ambient temperature or use heating to shorten curing time.

Packing specifications
This product is 30 KG per group; including group A25 KG (barrel) and group B 5 KG (pot)