Home > Products >
Thermal Grease Paste
>
Non-Conductive Heat Resistant Thermal Grease Paste 3.0 W/mK for CPU GPU IGBT Power Module Cooling

Non-Conductive Heat Resistant Thermal Grease Paste 3.0 W/mK for CPU GPU IGBT Power Module Cooling

Product Details:
Place of Origin: Guangdong, China
Brand Name: HANAST
Certification: RoHS
Model Number: HN300 (HN100-HN300 Series)
Detail Information
Place of Origin:
Guangdong, China
Brand Name:
HANAST
Certification:
RoHS
Model Number:
HN300 (HN100-HN300 Series)
Type:
Silicone-based Thermal Conductive Grease Paste
Model Series:
HN100 / HN200 / HN300 / HN400 /HN500/HN600(1.0 - 6.0 W/mK)
Appearance:
White/gray Paste-like Substance (HN300: Shiny Smooth Gray Paste)
Thermal Conductivity:
3.0 W/mK (HN300); 1.0-6.0 W/mK Across Grades
Density:
2.5 +/- 0.08 G/cm3 (HN300)
Oil Separation (200 C, 24 H):
<= 0.3% (HN300); <= 0.5% Max Across Grades
Volatile Matter (200 C, 24 H):
<= 0.7% (HN300); <= 0.8% Max Across Grades
Non-Curing:
Yes, Paste Remains Soft And Pumpable
Electrical Property:
Non-conductive, Dielectric Silicone Compound
Application:
CPU/GPU Heat Sinks, IGBT And Power Modules, LED Lighting, Power Supplies, Communication Equipment, Automotive Electronics
Certification:
RoHS
Feature:
Non-conductive, Heat Resistant Up To 200 C, Low Oil Separation, Low Thermal Resistance, Easy To Apply
Highlight:

High Light

Highlight:

Non-Conductive Thermal Grease Paste

,

Heat Resistant CPU GPU Thermal Paste

,

3.0 W/mK Power Module Cooling Paste

Trading Information
Minimum Order Quantity:
1 kg
Packaging Details:
1 kg/can, 5 kg/barrel or customized packing, with MSDS and TDS documents
Delivery Time:
3-7 working days for stock, 15-25 days for production
Payment Terms:
T/T,L/C,PayPal,Western Union
Supply Ability:
50000 kg per Month
Product Description

Non-Conductive Heat Resistant Thermal Conductive Grease Paste for Power Electronics

HN300 (HN series) is a silicone-based thermal conductive grease paste with up to 3.0 W/m·K thermal conductivity. It is electrically non-conductive and heat resistant, remaining stable at 200°C with extremely low oil separation and volatile matter. Applied between heat-generating electronic components and heat sinks, it expels air from microscopic gaps and delivers efficient, long-term reliable heat dissipation for CPUs, GPUs, IGBT modules and power electronics.

Key Features

  • Non-Conductive and Electrically Safe: Silicone-based dielectric compound will not cause short circuits or leakage, safe for live electronic assemblies.
  • Heat Resistant up to 200°C: Oil separation ≤0.3% and volatile matter ≤0.7% after 24 hours at 200°C (HN300) keep long-term stability under continuous high-temperature operation.
  • High Thermal Conductivity: Up to 3.0 W/m·K effectively lowers thermal resistance between chip and heat sink.
  • Non-Curing and Easy to Apply: Paste stays soft and pumpable, easy to dispense, does not harden or dry out, and allows rework during assembly.
  • Non-Corrosive: Safe on aluminum, copper and PCB materials without corrosion or oxidation of components.
  • Multiple Grades: HN100 / HN200 / HN300 / HN400 / HN500 / HN600 available from 1.0 to 6.0 W/m·K to match different power levels.
  • RoHS Compliant: Meets RoHS requirements for global electronics manufacturing.

Applications

  • Between CPU and heat sink for desktop and laptop cooling
  • Between GPU chip and heat sink on graphics cards
  • IGBT modules, power modules and high-power transistors
  • Motherboard power delivery modules (VRM) and SSD controllers
  • LED lighting, power supplies and communication equipment
  • Automotive electronics and EV component thermal management

Packaging and Supply

Available in 1 kg/can and 5 kg/barrel with customized packing on request. MSDS and TDS documentation provided. OEM/ODM service and free samples are welcome. Contact us for factory-direct wholesale pricing and technical support.