HN-5508AB is a transparent two-component epoxy potting compound with a 5:1 mix ratio, specially formulated for 5G base station power supply modules, telecom rectifiers and communication electronics encapsulation. It cures at room temperature or low temperature with low viscosity and long operation time, giving excellent fluidity and easy penetration into narrow clearances of PCBs and power components. The cured body is bubble-free with a smooth glossy surface and high hardness, providing long-term waterproof protection, outstanding electrical insulation and reliable mechanical support for outdoor telecom equipment.
| Item | Specification |
|---|---|
| Mix Ratio (A:B) | 5:1 by weight |
| Appearance | Transparent / clear liquid |
| Specific Gravity | Part A 1.4-1.5 g/cm³, Part B 1.05 g/cm³ |
| Viscosity at 25℃ | Part A 4500-6000 cps, Part B 150-250 cps |
| Pot Life at 25℃ | 2-3 hours (100g mix) |
| Curing Condition | 25℃/6-8h surface dry, 12-16h fully cured; or 60-80℃/1.5-2h |
| Hardness (Shore D) | 80 |
| Tensile Strength | 16-18 kg/cm² |
| Compressive Strength | 18-22 kg/cm² |
| Dielectric Strength | 20-22 kV/mm |
| Surface Resistance | 1.2*10^14 Ω·cm |
| Volume Resistance | 1.1*10^15 Ω·cm |
| Shrinkage | 0.35-0.55% |
| Water Absorption | <0.03% (25℃*24h) |
| Distortion Temperature | 130-150℃ |
| Low Temperature Resistance | -30℃ |
| Shelf Life | 6 months in sealed original containers at 25℃ |
5G base station power supply modules, telecom rectifiers, communication power systems, circuit boards, transformers, high-voltage packs, sensors, filters, ignition coils and other electronic components requiring insulation, flame retardancy and temperature resistance.
Customization and OEM/ODM supported. Contact us for free samples.