22 kV/mm Epoxy Potting Compound 5:1 High Dielectric Strength Resin for Aerospace Electronic Module Encapsulation

22 kV/mm Epoxy Potting Compound 5:1 High Dielectric Strength Resin for Aerospace Electronic Module Encapsulation

HN-5508AB is a two-component epoxy potting compound with a 5:1 mix ratio, specially formulated for aerospace electronic module encapsulation, avionics circuit protection and high-voltage component insulation. Based on thermosetting epoxy resin, it reacts with the curing agent to form a robust and durable insulator with excellent insulation properties, chemical resistance, high mechanical strength and strong adhesion. With dielectric strength up to 22 kV/mm, it provides reliable insulation, moisture protection, dustproofing, waterproofing and physical fixing for electronic components operating in demanding aerospace and harsh-environment applications.

Key Features

• Aerospace-grade reliability: high mechanical strength and adhesion for electronic products requiring resistance to harsh environments, vibration and thermal cycling.
• High dielectric strength: 22 kV/mm insulation rating protects high-voltage aerospace electronic modules from arcing and breakdown.
• Waterproof & moisture-proof: water absorption below 0.03% (25℃*24h) seals modules against humidity, condensation and dust.
• Wide temperature range: stable performance from -30℃ to 130-150℃ for avionics thermal environments.
• Chemical resistance: cured material resists chemical corrosion, moisture and air aging.
• 5:1 two-component system: simple mix ratio, low viscosity and long operation time compatible with automatic dispensing lines.
• ROHS & SGS compliant: meets environmental requirements for electronics and aerospace supply chains.

Technical Parameters

Applications

Aerospace electronic modules, avionics systems, capacitors, transformers, sensors, LED modules, circuit boards and other electronic products requiring high dielectric strength, high mechanical strength and resistance to harsh environments.

Customization and OEM/ODM supported. Contact us for free samples.