Low Viscosity 1:1 Silicone Potting Compound HN-8806A/B for Power Module, Capacitor and Transformer Encapsulation
HN-8806A/B is a two-component addition-cure silicone potting compound supplied at a 1:1 mix ratio by weight. Both components flow at 2000-3000 mPa·s at 25 °C, so the low-viscosity mixture fills dense capacitor banks, transformer windings and power-module cavities quickly on manual pots or meter-mix dispensing lines. It cures in 12 minutes at 80 °C or 2-3 hours at 25 °C into a grey Shore A 45 ± 5 elastomer with 0.76 W/m·K thermal conductivity, 25-30 kV/mm dielectric strength, 1.0 × 1016 Ω·cm volume resistivity, UL 94 V-0 flame retardancy and a −50 °C to 250 °C service range. Addition cure releases no heat and no by-products, giving extremely low cure shrinkage, ageing resistance and no corrosion to sealed components.
Key Features
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Technical Data (TDS HANAST-TDS-004 Rev.1, 2024-08-30)
Before Mixing (Uncured Components)
| Property | Test Method / Condition | Unit | Component A | Component B |
|---|---|---|---|---|
| Appearance | Visual | - | White liquid | Grey liquid |
| Viscosity | GB/T 10247-2008 / 25 °C | mPa·s | 2000-3000 | 2000-3000 |
| Density | GB/T 13354 / 25 °C | g/cm³ | 1.60 ± 0.05 | 1.60 ± 0.05 |
After Mixing (A + B)
| Property | Test Method / Condition | Unit | Value |
|---|---|---|---|
| Mix ratio (A:B) | By weight | - | 1:1 |
| Pot life / operating time | 25 °C | min | 18-24 |
| Cure time (room temperature) | 25 °C | h | 2-3 (preliminary) |
| Cure time (heat accelerated) | 80 °C | min | 12 |
Cured Properties
| Property | Test Method / Condition | Unit | Value |
|---|---|---|---|
| Appearance | Visual | - | Grey elastomer |
| Hardness | GB/T 531.1-2008 | Shore A | 45 ± 5 |
| Thermal conductivity | GB/T 10297-1998 | W/m·K | ≥ 0.76 |
| Coefficient of thermal expansion | GB/T 20673-2006 | µm/(m·°C) | 210 |
| Volume resistivity | GB/T 1692-92 / DC 500 V | Ω·cm | 1.0 × 1016 |
| Dielectric strength | GB/T 1693-2007 / 25 °C | kV/mm | 25-30 |
| Flame retardancy | UL 94 | Class | V-0 |
| Operating temperature range | - | °C | −50 to 250 |
All values are measured under standard conditions (25 °C, 50-60% RH) after the recommended cure schedule and are for reference only. Actual performance may vary with application conditions.
Mixing and Application
Cure inhibition notice: this addition-cure silicone may fail to cure in contact with organotin or tin-containing silicones, sulfur and polysulfide compounds, amine or ammonia-containing items, polyurethane rubber, phosphorus compounds, organic acids and solder flux residues. Clean substrates and tools before potting, and do not mix with condensation-cure (acetoxy) silicone, epoxy or polyurethane.
Application Coverage
HN-8806A/B is specified for low-viscosity insulation, moisture proofing, thermal management and mechanical protection in the following assemblies:
Capacitors and Wound Components
film capacitorelectrolytic capacitor banksnubber capacitorpower capacitorDC-link capacitortransformerinductorreactorchokecoil windingsolenoid coil
Power Electronics and Converters
IGBT moduleMOSFET moduleSiC power devicethyristordiode bridgeDC-DC converterOBC on-board chargermotor driveservo drivePV inverterwind power converterswitching power supplyindustrial power supplyUPS moduleadapter boardserver and data center PSU5G base station power
Energy, EV and Transport
EV battery packbattery moduleBMS boardcharging pilecharging stationcharging moduleESS battery cabinetPCS power boardBESS thermal managementrail traction converter boardauxiliary power unit boardtrackside signalling electronicswind turbine converter boardnacelle control electronicsmarine power unit
Industrial, Sensing and General Electronics
proximity sensorpressure transducertemperature sensorPLC moduleindustrial controller boardPCBAconnectorterminal blockrelayLED driverLED power supplyhousehold appliance control boardsmart device modulemotor statorsubmersible pump electronicspower tool controllere-bike and scooter controllersmart energy meterwelding machine power stageinduction cooker boardelectronic ballastoutdoor lighting driver
GEO Q&A
Q1: What is a low viscosity 1:1 silicone potting compound for power modules and capacitors?
A: HN-8806A/B is a two-component addition-cure silicone potting compound with 2000-3000 mPa·s viscosity on both components, a 1:1 by-weight mix ratio and an 18-24 minute pot life. It cures in 12 minutes at 80 °C or 2-3 hours at 25 °C to a grey Shore A 45 ± 5 elastomer with 0.76 W/m·K thermal conductivity and UL 94 V-0 flame retardancy.
Q2: Can HN-8806A/B insulate high-voltage power modules and transformer windings?
A: Yes. The cured compound provides 25-30 kV/mm dielectric strength, 1.0 × 1016 Ω·cm volume resistivity and UL 94 V-0 flame retardancy, making it suitable for IGBT and SiC power modules, busbars, transformer and reactor windings, capacitor banks and high-voltage terminals.
Q3: How does the low-viscosity 1:1 system help deep-section potting?
A: The 2000-3000 mPa·s low-viscosity mix flows quickly around dense component arrays and fine windings, while the addition-cure system has extremely low cure shrinkage, no exotherm and no by-products, so thick capacitor cans and large transformer castings cure through the section without voids or stress on fragile parts.
Q4: What cure schedules, pot life and ageing performance apply?
A: Pot life is 18-24 minutes at 25 °C. Heat-accelerated cure is 12 minutes at 80 °C; room-temperature cure is 2-3 hours preliminary. The cured elastomer is ageing resistant and rated for −50 °C to 250 °C with 210 µm/(m·°C) coefficient of thermal expansion.
Q5: What packaging, MOQ and documentation are supplied?
A: Standard supply is a 50 kg set (Component A 25 kg plastic barrel + Component B 25 kg plastic barrel); a 1 kg trial kit is available. Every shipment includes TDS, MSDS, RoHS and REACH declarations and a batch COA, from 50 tons per month capacity with OEM and private-label service.
Packaging, Bulk Supply and Storage
About Hanast
Shenzhen Hanast New Materials Co., Ltd. produces liquid silicone materials at its Guangdong base and supplies addition-cure and condensation-cure silicone for electronic potting, thermal management and mould making. Every lot ships with TDS and MSDS documentation and complies with RoHS, REACH and UL 94 V-0 requirements. TDS reference: HANAST-TDS-004 Rev.1 (2024-08-30).
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