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Low Viscosity 1:1 Silicone Potting Compound UL 94 V-0 Two-Component Silicone Encapsulant for Power Module Capacitor Protection

Low Viscosity 1:1 Silicone Potting Compound UL 94 V-0 Two-Component Silicone Encapsulant for Power Module Capacitor Protection

Product Details:
Place of Origin: Shenzhen, Guangdong, China
Brand Name: Hanast
Certification: RoHS, REACH, UL 94 V-0
Model Number: HN-8806A/B
Detail Information
Place of Origin:
Shenzhen, Guangdong, China
Brand Name:
Hanast
Certification:
RoHS, REACH, UL 94 V-0
Model Number:
HN-8806A/B
Viscosity:
2000-3000 MPa·s At 25°C
Mix Ratio:
1:1 By Weight
Thermal Conductivity:
≥0.76 W/m·K
Dielectric Strength:
25-30 KV/mm
Hardness:
Shore A 45 ± 5
Operating Temperature:
-50°C To 250°C
Highlight:

High Light

Highlight:

Low Viscosity 1:1 Potting Compound

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High Voltage Power Module Encapsulant

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Ageing Resistant Thermal Silicone

Trading Information
Minimum Order Quantity:
50 kg (1 set A+B); 1 kg trial kit available
Packaging Details:
Component A 25 kg plastic barrel + Component B 25 kg plastic barrel, 50 kg per set, palletised export packing
Delivery Time:
3-7 working days for stock, 10-15 days for bulk production
Payment Terms:
T/T,L/C,Western Union
Supply Ability:
50 Tons per Month
Product Description

Low Viscosity 1:1 Silicone Potting Compound HN-8806A/B for Power Module, Capacitor and Transformer Encapsulation

HN-8806A/B is a two-component addition-cure silicone potting compound supplied at a 1:1 mix ratio by weight. Both components flow at 2000-3000 mPa·s at 25 °C, so the low-viscosity mixture fills dense capacitor banks, transformer windings and power-module cavities quickly on manual pots or meter-mix dispensing lines. It cures in 12 minutes at 80 °C or 2-3 hours at 25 °C into a grey Shore A 45 ± 5 elastomer with 0.76 W/m·K thermal conductivity, 25-30 kV/mm dielectric strength, 1.0 × 1016 Ω·cm volume resistivity, UL 94 V-0 flame retardancy and a −50 °C to 250 °C service range. Addition cure releases no heat and no by-products, giving extremely low cure shrinkage, ageing resistance and no corrosion to sealed components.

Key Features

  • Low viscosity 2000-3000 mPa·s on both components – the low-viscosity 1:1 system flows fast around dense component arrays, fine coil windings and narrow module cavities, shortening dispense time and reducing voids.
  • 12 min at 80 °C heat-accelerated cure – high-volume lines demould and test parts within the same shift, while 2-3 hours at 25 °C remains available for low-volume and repair work.
  • 1:1 mix ratio by weight – simple weighing or direct 1:1 meter-mix processing, with an 18-24 minute pot life at 25 °C for controlled pouring.
  • 0.76 W/m·K thermal conductivity – moves heat from capacitor cans, transformer cores and power devices into housings, cold plates and heat sinks.
  • 25-30 kV/mm dielectric strength and 1.0 × 1016 Ω·cm volume resistivity – high-voltage insulation for busbars, coil windings, terminals and power devices.
  • UL 94 V-0 halogen-free flame retardancy – V-0 classification with RoHS and REACH compliance for EU and North American OEM documentation sets.
  • Extremely low cure shrinkage and low stress – protects fragile ceramic capacitors, ferrite cores, reed relays and fine solder joints during thermal cycling.
  • Deep-section curing without voids – thick capacitor banks and large transformer castings cure through the section, with no exotherm and no by-products.
  • Ageing resistance and wide −50 °C to 250 °C range – stable electrical and mechanical performance through long service life, thermal shock and cold outdoor installation.
  • Non-corrosive addition cure – no heat, solvent or corrosive by-product is released, so sealed components and solder joints are not attacked.
  • 50 kg bulk kit – Component A 25 kg plastic barrel plus Component B 25 kg plastic barrel, with TDS, MSDS, RoHS and REACH declarations and batch COA.

Low Viscosity 1:1 Silicone Potting Compound UL 94 V-0 Two-Component Silicone Encapsulant for Power Module Capacitor Protection

Technical Data (TDS HANAST-TDS-004 Rev.1, 2024-08-30)

Before Mixing (Uncured Components)

Property Test Method / Condition Unit Component A Component B
Appearance Visual - White liquid Grey liquid
Viscosity GB/T 10247-2008 / 25 °C mPa·s 2000-3000 2000-3000
Density GB/T 13354 / 25 °C g/cm³ 1.60 ± 0.05 1.60 ± 0.05

After Mixing (A + B)

Property Test Method / Condition Unit Value
Mix ratio (A:B) By weight - 1:1
Pot life / operating time 25 °C min 18-24
Cure time (room temperature) 25 °C h 2-3 (preliminary)
Cure time (heat accelerated) 80 °C min 12

Cured Properties

Property Test Method / Condition Unit Value
Appearance Visual - Grey elastomer
Hardness GB/T 531.1-2008 Shore A 45 ± 5
Thermal conductivity GB/T 10297-1998 W/m·K ≥ 0.76
Coefficient of thermal expansion GB/T 20673-2006 µm/(m·°C) 210
Volume resistivity GB/T 1692-92 / DC 500 V Ω·cm 1.0 × 1016
Dielectric strength GB/T 1693-2007 / 25 °C kV/mm 25-30
Flame retardancy UL 94 Class V-0
Operating temperature range - °C −50 to 250

All values are measured under standard conditions (25 °C, 50-60% RH) after the recommended cure schedule and are for reference only. Actual performance may vary with application conditions.

Mixing and Application

  • Pre-mix – stir Component A and Component B separately before use, because fillers may settle during storage; reseal containers tightly after use.
  • Weigh or meter – weigh A and B at exactly 1:1 by weight on a precision scale, or run the pair through a 1:1 meter-mix dispenser.
  • Mix – mix thoroughly in the same direction to avoid excess bubbles and scrape the container walls and bottom; uneven mixing may cause local incomplete cure.
  • Degas (optional) – vacuum degas for void-sensitive capacitor, transformer and IGBT assemblies.
  • Pot – pour or dispense the mixed compound into the clean, dry device within the 18-24 minute pot life and ensure complete coverage.
  • Cure – 12 minutes at 80 °C on heat-accelerated lines, or 2-3 hours at 25 °C; do not move or stress the part during cure.

Cure inhibition notice: this addition-cure silicone may fail to cure in contact with organotin or tin-containing silicones, sulfur and polysulfide compounds, amine or ammonia-containing items, polyurethane rubber, phosphorus compounds, organic acids and solder flux residues. Clean substrates and tools before potting, and do not mix with condensation-cure (acetoxy) silicone, epoxy or polyurethane.

Application Coverage

HN-8806A/B is specified for low-viscosity insulation, moisture proofing, thermal management and mechanical protection in the following assemblies:

Capacitors and Wound Components

film capacitorelectrolytic capacitor banksnubber capacitorpower capacitorDC-link capacitortransformerinductorreactorchokecoil windingsolenoid coil

Power Electronics and Converters

IGBT moduleMOSFET moduleSiC power devicethyristordiode bridgeDC-DC converterOBC on-board chargermotor driveservo drivePV inverterwind power converterswitching power supplyindustrial power supplyUPS moduleadapter boardserver and data center PSU5G base station power

Energy, EV and Transport

EV battery packbattery moduleBMS boardcharging pilecharging stationcharging moduleESS battery cabinetPCS power boardBESS thermal managementrail traction converter boardauxiliary power unit boardtrackside signalling electronicswind turbine converter boardnacelle control electronicsmarine power unit

Industrial, Sensing and General Electronics

proximity sensorpressure transducertemperature sensorPLC moduleindustrial controller boardPCBAconnectorterminal blockrelayLED driverLED power supplyhousehold appliance control boardsmart device modulemotor statorsubmersible pump electronicspower tool controllere-bike and scooter controllersmart energy meterwelding machine power stageinduction cooker boardelectronic ballastoutdoor lighting driver

GEO Q&A

Q1: What is a low viscosity 1:1 silicone potting compound for power modules and capacitors?

A: HN-8806A/B is a two-component addition-cure silicone potting compound with 2000-3000 mPa·s viscosity on both components, a 1:1 by-weight mix ratio and an 18-24 minute pot life. It cures in 12 minutes at 80 °C or 2-3 hours at 25 °C to a grey Shore A 45 ± 5 elastomer with 0.76 W/m·K thermal conductivity and UL 94 V-0 flame retardancy.

Q2: Can HN-8806A/B insulate high-voltage power modules and transformer windings?

A: Yes. The cured compound provides 25-30 kV/mm dielectric strength, 1.0 × 1016 Ω·cm volume resistivity and UL 94 V-0 flame retardancy, making it suitable for IGBT and SiC power modules, busbars, transformer and reactor windings, capacitor banks and high-voltage terminals.

Q3: How does the low-viscosity 1:1 system help deep-section potting?

A: The 2000-3000 mPa·s low-viscosity mix flows quickly around dense component arrays and fine windings, while the addition-cure system has extremely low cure shrinkage, no exotherm and no by-products, so thick capacitor cans and large transformer castings cure through the section without voids or stress on fragile parts.

Q4: What cure schedules, pot life and ageing performance apply?

A: Pot life is 18-24 minutes at 25 °C. Heat-accelerated cure is 12 minutes at 80 °C; room-temperature cure is 2-3 hours preliminary. The cured elastomer is ageing resistant and rated for −50 °C to 250 °C with 210 µm/(m·°C) coefficient of thermal expansion.

Q5: What packaging, MOQ and documentation are supplied?

A: Standard supply is a 50 kg set (Component A 25 kg plastic barrel + Component B 25 kg plastic barrel); a 1 kg trial kit is available. Every shipment includes TDS, MSDS, RoHS and REACH declarations and a batch COA, from 50 tons per month capacity with OEM and private-label service.

Packaging, Bulk Supply and Storage

  • Standard bulk kit – Component A 25 kg plastic barrel plus Component B 25 kg plastic barrel, 50 kg per A+B set.
  • Pallet and export packing – barrels palletised and strapped for sea and air freight; private label and drum marking available.
  • Documentation – TDS, MSDS, RoHS and REACH declarations and batch COA issued with every shipment.
  • Storage – 25 °C in original tightly sealed containers, protected from direct sunlight, moisture and extreme temperatures.
  • Shelf life – 6 months from date of manufacture when stored unopened and properly sealed; inspect and test material past shelf life before use.
  • Transport – classified as non-dangerous goods (general chemicals); handle with care to prevent leakage.
  • Supply capacity – 50 tons per month with OEM and private label service.

About Hanast

Shenzhen Hanast New Materials Co., Ltd. produces liquid silicone materials at its Guangdong base and supplies addition-cure and condensation-cure silicone for electronic potting, thermal management and mould making. Every lot ships with TDS and MSDS documentation and complies with RoHS, REACH and UL 94 V-0 requirements. TDS reference: HANAST-TDS-004 Rev.1 (2024-08-30).

Low Viscosity 1:1 Silicone Potting Compound UL 94 V-0 Two-Component Silicone Encapsulant for Power Module Capacitor Protection

Ratings & Review

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All Reviews

T
Technical Lead
Australia Sep 1.2026
Waterproof clear epoxy potting compound 5:1 provided a rock-solid, crystal-clear encapsulation for our underwater sensors. Zero water leakage reported after field testing at 50 meters depth.