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Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM

Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM

Brand Name: Hanast
Model Number: HN-8808AB
MOQ: 1KG
Price: 5.7
Packaging Details: Bucket package
Payment Terms: T/T
Detail Information
Place of Origin:
CHINA
Certification:
MSDS
Product Name:
Silicone Potting Glue
Color:
Black/White/Transparent Color, Can Customized
Application:
PCB/Battery/LED
Package:
5kgs/25kgs/200kgs/bag
Material:
Silicone&Agent
Keywords:
Waterproof Sealant
Viscosity:
Excellent Viscosity
Certificate:
MSDS RoHS UL
Feature:
Low And High Temperature Resistance
Thermal Conductivity:
Customize
Supply Ability:
20000000KG
Highlight:

Transparent Silicone Potting Compound

,

ODM Silicone Potting Compound

,

ODM electronic potting silicone

Product Description

HN-8808 two-component room temperature curing potting silicone

 

Product Specification

№. Items Technique Request
1 Exterior Transparent / White / Grey Liquid
2 Viscosity mPa.S (before curing) A: 2000, B: 50
3 Specific gravity (23℃) 0.98
4 In commission time (h, 25℃) 1–2h
5 Entirely sulfuration time (min, 25℃) 8–12h
6 Hardness (JIS A) 25A
7 Volume resistivity (Ω·cm) ≥1×10¹⁴
8 Strength of breakdown voltage (kV/mm) 18–25
9 Dielectric constant (1MHz) 2.5–3.0
10 Dielectric loss (1MHz) ≤4×10⁻³
11 Thermal conductivity (W/m·K) 0.1–0.20

 

Product Details

HN-8808 is a two-component room-temperature curing silicone specifically designed for the electronics industry. It offers excellent electrical properties and temperature resistance, making it ideal for PCB potting, sensor sealing, and LED encapsulation.

Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM 0

Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM 1

 

Key Advantages

High Insulation: Volume resistivity ≥1×10¹⁴ Ω·cm, breakdown voltage strength 18-25 kV/mm.

High-Temperature Resistance: Operating temperature range from -57°C to 250°C, suitable for high-temperature environments.

Fast Curing: Fully cures in 8-12 hours at room temperature, improving production efficiency.

Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM 2

 

Technical Parameters

Viscosity (Part A: 2000 mPa.S, Part B: 50 mPa.S)

Hardness (JIS A): 25A

Dielectric Constant (1MHz): 2.5-3.0

Thermal Conductivity: 0.1-0.20 W/m·K

Applications

PCB Potting: Protects circuit boards from moisture and vibration.

Sensor Sealing: Enhances durability and reliability of sensors.

LED Encapsulation: Provides excellent heat dissipation and insulation

Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM 3


 

Packing specifications
Component A: 10KG/20KG plastic barrel

Component B: 1KG plastic barrel

Good price  online

Products Details

Home > Products >
Silicone Potting Compound
>
Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM

Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM

Brand Name: Hanast
Model Number: HN-8808AB
MOQ: 1KG
Price: 5.7
Packaging Details: Bucket package
Payment Terms: T/T
Detail Information
Place of Origin:
CHINA
Brand Name:
Hanast
Certification:
MSDS
Model Number:
HN-8808AB
Product Name:
Silicone Potting Glue
Color:
Black/White/Transparent Color, Can Customized
Application:
PCB/Battery/LED
Package:
5kgs/25kgs/200kgs/bag
Material:
Silicone&Agent
Keywords:
Waterproof Sealant
Viscosity:
Excellent Viscosity
Certificate:
MSDS RoHS UL
Feature:
Low And High Temperature Resistance
Thermal Conductivity:
Customize
Minimum Order Quantity:
1KG
Price:
5.7
Packaging Details:
Bucket package
Delivery Time:
3-7 work days
Payment Terms:
T/T
Supply Ability:
20000000KG
Highlight:

Transparent Silicone Potting Compound

,

ODM Silicone Potting Compound

,

ODM electronic potting silicone

Product Description

HN-8808 two-component room temperature curing potting silicone

 

Product Specification

№. Items Technique Request
1 Exterior Transparent / White / Grey Liquid
2 Viscosity mPa.S (before curing) A: 2000, B: 50
3 Specific gravity (23℃) 0.98
4 In commission time (h, 25℃) 1–2h
5 Entirely sulfuration time (min, 25℃) 8–12h
6 Hardness (JIS A) 25A
7 Volume resistivity (Ω·cm) ≥1×10¹⁴
8 Strength of breakdown voltage (kV/mm) 18–25
9 Dielectric constant (1MHz) 2.5–3.0
10 Dielectric loss (1MHz) ≤4×10⁻³
11 Thermal conductivity (W/m·K) 0.1–0.20

 

Product Details

HN-8808 is a two-component room-temperature curing silicone specifically designed for the electronics industry. It offers excellent electrical properties and temperature resistance, making it ideal for PCB potting, sensor sealing, and LED encapsulation.

Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM 0

Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM 1

 

Key Advantages

High Insulation: Volume resistivity ≥1×10¹⁴ Ω·cm, breakdown voltage strength 18-25 kV/mm.

High-Temperature Resistance: Operating temperature range from -57°C to 250°C, suitable for high-temperature environments.

Fast Curing: Fully cures in 8-12 hours at room temperature, improving production efficiency.

Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM 2

 

Technical Parameters

Viscosity (Part A: 2000 mPa.S, Part B: 50 mPa.S)

Hardness (JIS A): 25A

Dielectric Constant (1MHz): 2.5-3.0

Thermal Conductivity: 0.1-0.20 W/m·K

Applications

PCB Potting: Protects circuit boards from moisture and vibration.

Sensor Sealing: Enhances durability and reliability of sensors.

LED Encapsulation: Provides excellent heat dissipation and insulation

Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM 3


 

Packing specifications
Component A: 10KG/20KG plastic barrel

Component B: 1KG plastic barrel