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Transparent 2 Part RTV Silicone Potting Compound HN-8808AB 10:1 Ratio Encapsulation for LED Waterproof Insulation

Transparent 2 Part RTV Silicone Potting Compound HN-8808AB 10:1 Ratio Encapsulation for LED Waterproof Insulation

Product Details:
Place of Origin: Guangdong, China
Brand Name: Hanast
Certification: RoHS, REACH, ISO 9001:2015
Model Number: HN-8808AB
Detail Information
Place of Origin:
Guangdong, China
Brand Name:
Hanast
Certification:
RoHS, REACH, ISO 9001:2015
Model Number:
HN-8808AB
Product Model:
HN-8808AB
Mixing Ratio:
10:1 (A:B By Weight)
Appearance (Mixed):
Transparent Light Yellow
Viscosity (Mixed):
2000-2600 MPa·s
Hardness:
Shore A 30-40
Thermal Conductivity:
0.5±0.1 W/m·K
Dielectric Strength:
≥14 KV/mm
Volume Resistivity:
≥5.0×10^14 Ω·cm
Dielectric Constant:
≤3.5
Curing Time At 25°C:
4-6 Hours
Operating Time At 25°C:
40-60 Minutes
Temperature Range:
-50°C To 200°C
Elongation At Break:
≤100%
Cure Type:
Condensation (RTV-2)
Highlight:

High Light

Highlight:

Optically Clear Electronic Encapsulation Compound

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LED Driver Waterproof Potting Material

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Transparent 10:1 RTV Silicone Potting

Trading Information
Minimum Order Quantity:
1 Set
Price:
USD 8-15 / kg
Packaging Details:
50kg/set (Component A 25kg + Component B 25kg), sealed plastic drum in export-grade corrugated carton
Delivery Time:
3-5 working days for sample, 7-15 days for bulk order
Payment Terms:
T/T,L/C,PayPal,Western Union
Supply Ability:
50000 kg per Month
Product Description
Transparent 2 Part RTV Silicone Potting Compound HN-8808AB 10:1 Ratio Encapsulation for LED Waterproof Insulation
2 Part Clear RTV Silicone Potting Compound HN-8808AB
Optically Clear Electronic Encapsulation & Waterproof Insulation Material

HN-8808AB is a premium two-part condensation cure RTV-2 silicone potting compound specifically developed for optoelectronic applications that require post-potting visual inspection. With a convenient 10:1 mixing ratio, exceptional clarity, and robust waterproof insulation performance, it is the ideal encapsulation solution for LED drivers, automotive electronic modules, and precision sensor assemblies.

Key Features & Advantages
  • Optically Clear Formulation: Transparent light yellow appearance after curing enables on-board visual inspection of components, solder joints, and LED arrays without removing the encapsulation—a critical advantage for LED driver PCB assemblies and quality control workflows.
  • Superior Waterproof Protection: Achieves IP67-equivalent moisture sealing with high volume resistivity (≥5.0×10¹⁴ Ω·cm) and dielectric strength (≥14 kV/mm), effectively protecting sensitive electronics from humidity, condensation, and water ingress in outdoor and harsh environment deployments.
  • 10:1 Convenient Mixing Ratio: The industry-preferred 10:1 ratio simplifies metering and dispensing operations on automated production lines. Compatible with static mixer nozzles and pneumatic dispensing equipment for high-volume manufacturing of LED modules and automotive ECU assemblies.
  • Wide Temperature Resilience: Maintains elastomeric properties across an extreme temperature range of -50°C to 200°C. Low thermal expansion stress prevents wire bond fatigue and component cracking, making it suitable for under-hood automotive electronics, outdoor LED lighting, and industrial power modules.
  • Room Temperature Cure: Condensation-cure mechanism cures at ambient temperature (25°C) with 4-6 hours to full set and 40-60 minutes of working time. No oven or heat curing required—reducing energy costs and eliminating thermal stress on heat-sensitive components during the encapsulation process.
  • Low Stress & Non-Corrosive: Neutral condensation cure releases no corrosive by-products. Shore A 30-40 softness combined with low shrinkage provides stress-relieving encapsulation for delicate wire bonds, SMD components, and flexible PCB assemblies—no cracking, no delamination over thermal cycling.
Target Applications
Application FieldSpecific Use CaseKey Benefit
LED Driver & Module PottingLED power supply encapsulation, outdoor LED display modules, underwater LED luminairesOptical clarity for visual QC, IP67 waterproof sealing, UV-stable elastomer
Automotive Electronic ModulesECU encapsulation, BMS protection, under-hood sensor potting, ADAS camera modules-50°C to 200°C stability, vibration damping, non-corrosive to copper traces
Power Modules & ConvertersSolar inverter potting, DC-DC converter encapsulation, industrial power supply protection14 kV/mm dielectric strength, 0.5 W/m·K thermal conductivity, long pot life
Sensor & Transducer AssemblyPressure sensors, proximity sensors, temperature transducers, IoT device sealingLow-stress soft gel protection, high volume resistivity, moisture barrier
Technical Specifications
Before Mixing
PropertyComponent AComponent B
AppearanceBlack liquidTransparent liquid
Base Chemical CompositionPolysiloxanePolysiloxane
Viscosity (cP)2000-280020-30
Density (g/cm³)1.42±0.02--
After Mixing (A+B, 10:1 Ratio)
PropertyValue
Appearance (Mixed)Transparent light yellow
Mixed Viscosity2000-2600 mPa·s
Density1.40±0.02 g/cm³
Operating Time at 25°C40-60 minutes
Curing Time at 25°C4-6 hours
HardnessShore A 30-40
Volume Resistivity≥5.0×10¹⁴ Ω·cm
Thermal Conductivity0.5±0.1 W/m·K
Dielectric Strength≥14 kV/mm
Dielectric Constant≤3.5
Elongation at Break≤100%
Temperature Range-50°C to 200°C
Packaging & Storage
  • Standard Packaging: 50kg/set (Component A 25kg + Component B 25kg) in sealed plastic drums
  • Alternative Packaging: 40kg/set (Component A 20kg + Component B 20kg)
  • Custom Packaging: Available upon request for OEM/ODM customers
  • Shelf Life: 6 months (best used within 3 months) when stored in a cool, dry place
  • Storage Conditions: Seal containers immediately after use. Avoid exposure to rain, direct sunlight, and moisture
  • Transport: Non-dangerous goods. No special transport classification required
Usage Instructions
  1. Ensure substrate surfaces are clean, dry, and free from oil or contaminants before application.
  2. Mix Component A and Component B at a 10:1 ratio by weight. Stir thoroughly until uniform color is achieved.
  3. Degas the mixture under vacuum (recommended 5-10 minutes at -0.1 MPa) to remove entrapped air bubbles for optimal optical clarity.
  4. Pour or dispense the mixed compound into the mold or directly onto the PCB assembly. Allow the material to self-level.
  5. Cure at room temperature (25°C) for 4-6 hours to achieve full mechanical and electrical properties.
Note: Do not heat-accelerate the curing process, as this may introduce bubbles. Mixed material should be used in one batch to avoid waste.
HN-8808AB silicone potting compound application and cured sample
HN-8808AB silicone potting compound packaging and technical details
Custom Formulation & OEM Manufacturing Available

Shenzhen Hanast New Material offers tailored silicone potting solutions with adjustable viscosity, hardness, thermal conductivity, and curing profiles. Our 5-step custom formulation process delivers sample batches within 3-5 working days.

Ratings & Review

Overall Rating

5.0
Based on 50 reviews for this supplier

Rating Snapshot

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100%
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All Reviews

J
J*e
Japan Jul 20.2026
Price and quality are our top priorities—I've been in this trade for years, and they truly stand out.
J
J*e
Japan Jul 20.2026
Price and quality are our top priorities—I've been in this trade for years, and they truly stand out.