High Thermal Conductivity Silicone Potting Compound 2.0 W/mK for Power Module Encapsulation

HN-8820A/B Two-Component Addition-Cure Silicone Potting Compound 2.0 W/m·K

HN-8820A/B is a two-component, addition-cure (platinum-catalysed) silicone potting compound engineered for efficient heat dissipation. With a thermal conductivity of 2.0 W/m·K, a low-viscosity 1:1 mix ratio by weight and good self-levelling fluidity, it pours easily and cures at room temperature or with heat acceleration. The cured grey elastomer (Shore A 45–50) keeps its rubber elasticity across a wide range and delivers excellent electrical insulation with reliable waterproof, moisture-proof and anti-ageing performance.

Key Features of Silicone Potting Compound

• Thermal conductivity of 2.0 ± 0.1 W/m·K for effective heat dissipation
• Wide operating temperature range: −40 °C to 200 °C
• Excellent electrical insulation: volume resistivity ≥ 5.0 × 10¹⁴ Ω·cm
• UL 94 V-0 flame retardancy
• Low viscosity (5000–8000 mPa·s) and 1:1 mix ratio for easy processing and degassing
• Good waterproof, moisture-proof and anti-ageing performance
• Cured hardness 45–50 Shore A for durable mechanical protection

Typical Applications of Silicone Potting Compound

• Potting and protection of general electronic components and circuit boards
• Power modules, including automotive HID lamp module power supplies
• Automotive ignition system module power supplies
• Network transformers and other electronic appliances

Technical Data of Silicone Potting Compound

Mixing & Application Instructions

1. Pre-mix: Stir Component A thoroughly before use as fillers may settle; shake or stir Component B well.
2. Weighing: Accurately weigh A and B per the 1:1 ratio by weight (not volume) using a precision scale.
3. Mixing: Mix until uniform in colour; scrape container walls and bottom. Avoid introducing excessive air.
4. Degassing (optional): For void-sensitive applications, degas under vacuum to remove entrapped air.
5. Pouring / Potting: Pour the mixed compound into the clean, dry device within pot life, ensuring full coverage.
6. Curing: Heat-accelerate at 80 °C for 10–20 minutes, or cure at room temperature (refer to pot life). Do not stress the part during cure.

Packaging

• Component A: 25 kg plastic barrel
• Component B: 25 kg plastic barrel
• Kit (A+B): 50 kg / set (25 kg + 25 kg)

Storage & Shelf Life

• Store in original, tightly sealed containers in a cool, dry, well-ventilated area at 5–25 °C.
• Protect from direct sunlight, moisture and extreme temperatures.
• Shelf life: 6 months from date of manufacture when stored as recommended.

About Our Company

The company was established in 2006 and is headquartered in Shenzhen, specializing in the research and development of new adhesive materials. It is a national-level specialized and innovative small giant enterprise. The company's factory in Xinhui, Jiangmen, Guangdong covers 60 acres with a total investment of 600 million. It has over 40 professional R&D personnel with more than 10 years of rich practical experience, led by researchers from the Chinese Academy of Sciences, all of whom are from domestic and international chemical engineering universities. The company maintains partnerships with several Fortune 500 companies such as Apple, BYD, and China Aerospace.