Latest company case about Shenzhen Hanast New Material co.,LTD Certifications

Currently, mainstream electronic potting compounds on the market are mainly divided into three categories based on their chemical systems: silicone, epoxy, and polyurethane. Silicone potting compounds are further divided into condensation-type and addition-type. However, even among electronic potting silicones, different models from the same manufacturer have vastly different prices. Ultimately, these price differences stem from variations in product formulation, curing method, overall performance, and applicable scenarios.

Condensation-type silicone is the most basic and cost-effective electronic potting silicone on the market, characterized by low cost and strong versatility.

A two-component system (common ratio 10:1) relies on absorbing moisture from the air to trigger a condensation reaction, completing curing and cross-linking by releasing small molecules such as alcohols and ketoximes. Simply put: its curing depends on air moisture; a closed environment will restrict this process, and it will also release trace amounts of small molecule gases.

The operating window is relatively long, and the requirements for mixing accuracy are relatively relaxed, making it suitable for manual operation and small-batch production. However, the deep curing speed is relatively slow, and the potting thickness is recommended to be controlled within 3cm. If it exceeds this, it can be applied in layers.

Suitable for basic packaging scenarios where performance requirements are not high, such as ordinary small household appliances, ordinary LED lamps, and conventional circuit boards.

Addition-type encapsulants are an upgraded version of silicone potting compounds. They have higher production costs and process requirements, and are therefore more expensive. They are characterized by high precision, high stability, non-corrosiveness, and strong weather resistance.

Relying on vinyl silicone oil and hydrogen-containing silicone oil, an addition reaction occurs under the action of a platinum catalyst, directly forming a stable network structure. No byproducts are released during the entire process.

Components A and B are precisely mixed in a 1:1 ratio. Curing can be done at room temperature or accelerated by heating. The short operating window makes it suitable for rapid assembly line operations.

Extremely low shrinkage, virtually no stress, friendly to precision components, excellent electrical insulation properties, and good heat resistance. Deep curing is possible; any thickness can be completely dried.

Note: Platinum catalyst is susceptible to poisoning: Contact with substances containing sulfur (S), nitrogen (N), phosphorus (P), tin (Sn), lead (Pb), amines, etc., deactivates the catalyst, interrupts the curing reaction, and the adhesive will never cure.

Specifically designed for high-end scenarios such as new energy electronics, automotive electronics, precision industrial control, and high-power outdoor equipment.

In summary, there is no absolutely better potting compound, only more suitable models. For general consumer applications, condensation-type compounds are chosen to control costs, while addition-type compounds are essential for high-end, precision, long-term durability, and demanding operating conditions to ensure the stability and lifespan of electronic products. Unsure which to choose? 👉Contact our technical staff, provide product parameters and operating conditions, and we will recommend suitable models and arrange sample testing free of charge.