HN-5508AB is a black two-component epoxy potting compound with a 5:1 mix ratio, specially formulated for power supply module, LED driver and other electronic component encapsulation. It cures at room temperature or low temperature with low viscosity, long working time and good fluidity, easily penetrating into narrow clearances of the product. After curing it delivers a bubble-free, smooth and glossy surface with high hardness, excellent flame retardancy and long-term high temperature resistance.
| Item | Specification |
|---|---|
| Appearance | Part A: Black liquid; Part B: light yellow transparent liquid |
| Mix Ratio | A:B = 5:1 (weight ratio) |
| Viscosity (25℃) | Part A: 4,500-6,000 cps; Part B: 150-250 cps |
| Specific Gravity | Part A: 1.4-1.5; Part B: 1.05 |
| Pot Life (25℃) | 2-3H (100g mix) |
| Curing Condition | 25℃/6-8H surface dry, 12-16H fully cured; or 60-80℃/1.5-2H |
| Hardness | Shore D 85-95 |
| Tensile Strength | 16-18 kg/cm² |
| Compressive Strength | 18-22 kg/cm² |
| Dielectric Strength | 20-22 kV/mm |
| Surface Resistance | 1.2×1014 Ω·cm |
| Volume Resistance | 1.1×1015 Ω·cm |
| Shrinkage | 0.35-0.55% |
| Water Absorption (25℃×24H) | <0.03% |
| Heat Distortion Temperature | 130-150℃ |
| Low Temperature Resistance | -30℃ |
| Flame Retardant | Yes (fire retardant grade) |
| Shelf Life (25℃ sealed) | 6 months |
HN-5508AB is widely used for power supply modules, LED drivers, transformers, resistors, filters, temperature sensors and controllers, ignition coils, high voltage packs and other electronic components requiring flame retardant, high temperature resistant and moisture-proof encapsulation.
Standard packing 25 kg/barrel; 1 kg sample kits available for evaluation. Store in a cool, dry and light-proof place, keep the workshop dust-free, and cover the unused glue promptly after opening. Shelf life 6 months under sealed storage at 25℃.