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Biocompatible ISO 10993 Epoxy Potting Compound with Shore D 85-95 Hardness and High Dielectric Strength 20-22 kV/mm for Medical Devices

Biocompatible ISO 10993 Epoxy Potting Compound with Shore D 85-95 Hardness and High Dielectric Strength 20-22 kV/mm for Medical Devices

Product Details:
Place of Origin: Guangdong, China
Brand Name: HANAST
Certification: RoHS Compliant
Model Number: HN-5508AB
Detail Information
Place of Origin:
Guangdong, China
Brand Name:
HANAST
Certification:
RoHS Compliant
Model Number:
HN-5508AB
Mix Ratio:
A:B = 5:1 By Weight
Pot Life:
2-3 H At 25 C (100 G Mix)
Volume Resistivity:
1.1 X 10^15 Ohm.cm
Heat Distortion Temperature:
130-150 C
Tensile Strength:
16-18 Kg/cm2
Hardness:
Shore D 85-95
Highlight:

High Light

Highlight:

Biocompatible ISO 10993 Epoxy Potting Compound

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Medical Device Electronics Encapsulant

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Electronics Grade Low Shrinkage Potting Resin

Trading Information
Minimum Order Quantity:
1 kg
Packaging Details:
Component A 25 kg plastic barrel + Component B 5 kg plastic pot, 30 kg/set kit
Delivery Time:
3-5 working days for samples, 7-15 days for bulk orders
Payment Terms:
T/T,L/C,Western Union,PayPal
Supply Ability:
50 Tons per Month
Product Description

HANAST HN-5508 A/B Electronics Grade Biocompatible ISO 10993 Epoxy Potting Compound for Medical Device Electronics Protection

HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compound formulated for electronics-grade, medical-device encapsulation. Mixed at a 5:1 ratio by weight, it flows with low viscosity and a long pot life, penetrates narrow gaps, and cures bubble-free into a smooth, glossy, high-hardness (Shore D 85-95) black encapsulant. With high dielectric strength, low shrinkage (0.35-0.55%), a low-void vacuum-degassing-friendly cure and a wide -30°C to 130-150°C service range, it is designed to support biocompatibility (ISO 10993) and IPC-class electronics protection requirements for medical and high-reliability electronics.

Biocompatible ISO 10993 Epoxy Potting Compound with Shore D 85-95 Hardness and High Dielectric Strength 20-22 kV/mm for Medical Devices

Key Features

  • Electronics-grade, high-reliability formulation for long-life component protection
  • Positions for biocompatible (ISO 10993) medical device electronics encapsulation
  • Designed for harsh and wide-temperature environments (-30°C to 130-150°C)
  • 5:1 two-component epoxy system, room-temperature cure or 60-80°C accelerated cure
  • High hardness Shore D 85-95 for rigid, impact-resistant component protection
  • High dielectric strength of 20-22 kV/mm with volume resistivity of 1.1 x 1015 ohm.cm
  • Low shrinkage (0.35-0.55%) for precision, dimensionally stable potting
  • Low outgassing, vacuum-degassing-friendly formulation for sealed electronics
  • Acid/alkali resistance, moisture proofing and humid-heat ageing resistance
  • High compressive strength (18-22 kg/cm2) and high bonding strength
  • Low viscosity and long pot life (2-3 h) for easy casting and narrow-gap penetration
  • RoHS compliant and classified as non-dangerous goods for global shipment
  • Custom OEM/ODM with free samples and wholesale bulk supply

Biocompatible ISO 10993 Epoxy Potting Compound with Shore D 85-95 Hardness and High Dielectric Strength 20-22 kV/mm for Medical Devices

Technical Specifications

Parameter Value
Type Two Component Biocompatible Electronics Grade Epoxy Potting Compound (medical-grade positioning)
Appearance before mixing Component A: black or white viscous epoxy resin; Component B: reddish / transparent low-viscosity liquid
Density A 1.4-1.5 g/cm3; B 1.05 g/cm3
Mix ratio (by weight) A : B = 5 : 1
Pot life / working time 2-3 h at 25°C (100 g mix)
Cure schedule 25°C: 6-8 h tack-free, 12-16 h fully cured; or 60-80°C: 1.5-2 h
Hardness (cured) Shore D 85-95
Dielectric strength 20-22 kV/mm
Volume resistivity 1.1 x 1015 ohm.cm
Tensile strength 16-18 kg/cm2
Compressive strength 18-22 kg/cm2
Shrinkage 0.35-0.55%
Water absorption < 0.03% (25°C x 24 h)
Heat distortion temperature 130-150°C
Low temperature resistance -30°C
Compliance RoHS compliant; non-dangerous goods; SDS available
Packaging Component A 25 kg plastic barrel + Component B 5 kg plastic pot, 30 kg/set kit
Shelf life 6 months in sealed containers at 25°C

Applications

HN-5508 A/B is widely used for potting and protection of medical-grade and high-reliability electronics: medical device electronics, medical sensors and probes, patient monitors and diagnostic equipment, infusion pumps, wearable and portable medical electronics, medical imaging and laboratory instruments, dental and healthcare IoT devices; power supply modules, aerospace and defense electronics, automotive ECU modules, EV battery packs and BMS boards, onboard chargers, LED drivers, 5G base station power units, solar inverter modules, wind turbine converters and hydrogen fuel cell components; transformers, resistors, filters, temperature sensors, temperature controllers, industrial sensors and motor stators; high-voltage ignition coils, high-voltage packages, downhole electronics, PCBs, aquarium and underwater equipment, negative-ion generators and ultrasonic atomizers. It suits sealed, vacuum and harsh-environment electronics that require electronics-grade insulation, biocompatibility positioning and long-term reliability.

Biocompatible ISO 10993 Epoxy Potting Compound with Shore D 85-95 Hardness and High Dielectric Strength 20-22 kV/mm for Medical Devices

Why Choose HN-5508 A/B

With high hardness, high dielectric strength, low shrinkage and a low-void, vacuum-degassing-friendly cure, HN-5508 A/B is one of the best potting compounds for reliable electronics and medical device protection. Hanast is a direct manufacturer based in Shenzhen, Guangdong, China, with a dedicated R&D laboratory. We supply free samples and wholesale bulk epoxy encapsulant across Asia and worldwide at factory-direct pricing, and offer custom OEM/ODM formulation of colour, viscosity, pot life, hardness and cure speed to match your specific medical device, power module, ECU or sensor design.

Packaging & Storage

Supplied as Component A (25 kg plastic barrel) and Component B (5 kg plastic pot), or as a ready 30 kg/set kit. Store in original, tightly sealed containers in a cool, dry, well-ventilated area at around 25°C, protected from direct sunlight, moisture and extreme temperatures. Shelf life is 6 months from date of manufacture. Classified as non-dangerous goods for transport.

About this supplier

Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.

We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including medical devices, electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation.

Biocompatible ISO 10993 Epoxy Potting Compound with Shore D 85-95 Hardness and High Dielectric Strength 20-22 kV/mm for Medical Devices

FAQ

  1. Q1: What is HN-5508 A/B and which applications does it suit?
    A1: HN-5508 A/B is a 5:1 two-component electronics grade epoxy potting compound with high hardness (Shore D 85-95) and high dielectric strength, designed for medical device electronics as well as power modules, automotive ECU modules, transformers, sensors and other high-reliability electronics.
  2. Q2: Is it suitable for medical device and biocompatible (ISO 10993) applications?
    A2: It is formulated for electronics-grade, medical device encapsulation and is positioned for biocompatibility (ISO 10993) requirements. Please contact us to confirm the exact compliance documentation required for your specific medical application.
  3. Q3: What are the mix ratio and curing schedule?
    A3: Mix Component A and Component B at a 5:1 ratio by weight. Pot life is 2-3 hours at 25°C (100 g mix); tack-free in 6-8 hours and fully cured in 12-16 hours at 25°C, or in 1.5-2 hours at 60-80°C when curing time needs to be optimized.
  4. Q4: Can it be vacuum-degassed, and what is the insulation and shrinkage performance?
    A4: Yes, it can be vacuum-degassed to remove air for void-free potting. It offers high dielectric strength of 20-22 kV/mm, volume resistivity of 1.1 x 1015 ohm.cm and low shrinkage of 0.35-0.55% for dimensionally stable insulation.
  5. Q5: Do you offer samples, customization and wholesale supply?
    A5: Yes. We are a direct China manufacturer offering free samples and wholesale bulk supply at factory-direct pricing, with custom OEM/ODM formulation of colour, viscosity, pot life, hardness and cure speed. MOQ is 1 kg in 25 kg (A) + 5 kg (B) 30 kg/set kits; samples ship in 3-5 working days and bulk orders in 7-15 days.