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Latest company case about Shenzhen Hanast New Material co.,LTD Certifications

Photovoltaic Inverter Intelligent Power Module (IPM)

2025-09-11

Application Scenario: IGBT/SiC power module packaging in photovoltaic inverters.

Challenge: Frequent power cycling generates significant thermal stress, which can lead to fatigue cracking in the solder layer of rigid packaging materials, causing thermal failure.

Solution: Using an extremely low-stress, high-thermal-conductivity silicone gel instead of traditional epoxy resin for potting.

Benefit: The soft nature of silicone gel effectively absorbs thermal stress, preventing chip delamination and bond wire breakage. Its high thermal conductivity ensures efficient heat dissipation, significantly improving the module's power cycle life and reliability.

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