12 Min Fast Cure Low Stress 1:1 Silicone Potting Compound Silicone Encapsulant for Power Supply LED Driver

HN-8806A/B is a two-component addition-cure silicone potting compound mixed 1:1 by weight. It flows at 2000-3000 mPa·s and cures in only 12 minutes at 80 °C, or 2-3 hours at 25 °C, into a low-stress grey Shore A 45 ± 5 elastomer. The cured material combines 0.76 W/m·K thermal conductivity, 25-30 kV/mm dielectric strength, 1.0 × 10¹⁶ Ω·cm volume resistivity, UL 94 V-0 halogen-free flame retardancy and a −50 °C to 250 °C service range. Addition cure releases no heat and no by-products, with extremely low shrinkage, so power supplies, LED drivers, adapters, sensors and control boards are protected without stress or corrosion.

• Fast cure 12 min at 80 °C – heat-accelerated lines demould, test and pack within the same shift, cutting work-in-progress and oven time on high-volume power supply and LED driver production.
• 2-3 h room-temperature cure backup – large cavities, low-volume batches and field repair work can cure at 25 °C without an oven.
• Low-stress addition cure – no exotherm, no by-products and extremely low shrinkage, so fragile components, wire bonds and solder joints are not pushed or cracked during cure.
• 1:1 mix ratio by weight – equal-part dosing for manual pots or direct 1:1 meter-mix dispensing, with an 18-24 minute pot life at 25 °C.
• Low viscosity 2000-3000 mPa·s – flows quickly around densely packed boards, transformer windings and connector pins for complete fill and fewer voids.
• 0.76 W/m·K thermal conductivity – conducts heat from transformers, MOSFETs, LED boards and power devices into housings, heat sinks and metal cases.
• 25-30 kV/mm dielectric strength and 1.0 × 10¹⁶ Ω·cm volume resistivity – high electrical insulation for switching power supplies, drivers, terminals and high-voltage traces.
• UL 94 V-0 halogen-free flame retardancy – V-0 classification with RoHS and REACH compliance for EU and North American OEM documentation.
• Wide −50 °C to 250 °C service range – stable elasticity through power cycling, thermal shock, outdoor installation and high-temperature operation.
• Flexible Shore A 45 ± 5 elastomer – absorbs vibration and thermal expansion, protecting ceramic capacitors, ferrite cores and relays.
• Deep-section curing without voids – thick driver blocks and potted modules cure through the section with no exotherm and no by-products.
• OEM and private label supply – 50 kg set (25 kg A + 25 kg B), custom drum labels, kit sizes and batch COA, from 50 tons per month capacity.

All values are measured under standard conditions (25 °C, 50-60% RH) after the recommended cure schedule and are for reference only. Actual performance may vary with application conditions.

• Pre-mix – stir Component A and Component B separately before use, because fillers may settle during storage; reseal containers tightly after use.
• Weigh or meter – weigh A and B at exactly 1:1 by weight on a precision scale, or run the pair through a 1:1 meter-mix dispenser.
• Mix – mix thoroughly in the same direction to limit air entrapment and scrape the container walls and bottom; uneven mixing may cause local incomplete cure.
• Degas (optional) – vacuum degas for void-sensitive power supplies, drivers and potted modules.
• Pot – pour or dispense the mixed compound into the clean, dry device within the 18-24 minute pot life and ensure complete coverage.
• Cure – 12 minutes at 80 °C on heat-accelerated lines, or 2-3 hours at 25 °C; do not move or stress the part during cure.

Cure inhibition notice: this addition-cure silicone may fail to cure in contact with organotin or tin-containing silicones, sulfur and polysulfide compounds, amine or ammonia-containing items, polyurethane rubber, phosphorus compounds, organic acids and solder flux residues. Clean substrates and tools before potting, and do not mix with condensation-cure (acetoxy) silicone, epoxy or polyurethane.

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• Standard bulk kit – Component A 25 kg plastic barrel plus Component B 25 kg plastic barrel, 50 kg per A+B set.
• Pallet and export packing – barrels palletised and strapped for sea and air freight; private label and drum marking available.
• Documentation – TDS, MSDS, RoHS and REACH declarations and batch COA issued with every shipment.
• Storage – 25 °C in original tightly sealed containers, protected from direct sunlight, moisture and extreme temperatures.
• Shelf life – 6 months from date of manufacture when stored unopened and properly sealed; inspect and test material past shelf life before use.
• Transport – classified as non-dangerous goods (general chemicals); handle with care to prevent leakage.
• Supply capacity – 50 tons per month with OEM and private label service.

Shenzhen Hanast New Materials Co., Ltd. produces liquid silicone materials at its Guangdong base and supplies addition-cure and condensation-cure silicone for electronic potting, thermal management and mould making. Every lot ships with TDS and MSDS documentation and complies with RoHS, REACH and UL 94 V-0 requirements. TDS reference: HANAST-TDS-004 Rev.1 (2024-08-30).