Latest company case about Shenzhen Hanast New Material co.,LTD Certifications

Project Background

A Tier-1 battery management system (BMS) supplier serving electric vehicle and energy storage OEMs in Southeast Asia approached Hanast with a hard thermal bottleneck. Its next-generation BMS master board packed 48 MOSFETs and shunt resistors into a sealed IP67 aluminium enclosure. During 120 A continuous discharge testing, power-stage junction temperatures reached 118 °C against a vehicle OEM target of 95 °C, forcing the customer to derate output by roughly 18% and delaying the platform's SOP date.

The incumbent interface was a 1.8 W/mK thermal grease applied at 80 µm bond line thickness (BLT). Two failures showed up in the lab: insufficient bulk conductivity, and grease pump-out after thermal cycling, which raised thermal resistance by 22% within 300 cycles under -40 °C to 150 °C shock testing.

Customer Requirement Summary

• Thermal conductivity of at least 3.0 W/mK in the finished assembly
• Bond line thickness of 50 µm or less at 0.3 MPa mounting pressure
• No pump-out, dry-out or hardening over 1,000 thermal cycles from -40 °C to 150 °C
• UL 94 V-0 flame rating, RoHS and REACH compliance for automotive programmes
• Low volatile and low oil-bleed behaviour to protect the sealed enclosure and adjacent PCB
• Stable supply for a 3-year production programme with OEM/ODM private labelling

Solution: HNS-TG300 Silicone Thermal Grease

Hanast recommended the HNS-TG300 series, a non-curing silicone thermal grease filled with a hybrid aluminium oxide and zinc oxide system. The formulation combines 3.0 W/mK bulk conductivity with a thixotropic rheology that holds its shape during dispensing, so the material spreads to a thin, even bond line instead of flowing away from the die area.

Implementation Process

1. Thermal simulation review: Hanast engineers modelled the 48-MOSFET layout and confirmed that a 40-50 µm BLT would bring the hot spot under the 95 °C target.
2. Dispensing trial: The grease was validated on the customer's existing pneumatic dispensing line with a 0.6 mm nozzle, requiring no new capital equipment.
3. Bond line verification: Cross-sections from 30 assemblies confirmed an average BLT of 42 µm with less than 8% variation across the heatsink footprint.
4. Reliability testing: 1,000 thermal shock cycles from -40 °C to 150 °C, plus 1,000 h damp heat at 85 °C / 85% RH.
5. Production release: Three pre-production lots were audited for viscosity, conductivity and oil bleed before mass production sign-off.

Validation Results

Commercial Outcome

• The customer removed the 18% output derating and recovered the full current rating of the platform.
• Platform SOP was pulled forward by seven weeks because no redesign of the heatsink or enclosure was needed.
• Material consumption dropped 31% per assembly thanks to the thinner bond line, offsetting the higher unit price of the 3.0 W/mK grade.
• Hanast now supplies the programme from its 40,000 m² Shenzhen plant under a 3-year OEM agreement with private labelling and local technical support.

Why This Matters for EV BMS Designs

BMS boards are thermally dense and mechanically constrained: power semiconductors sit close to temperature-sensitive sensing circuits, and the enclosure is usually sealed for IP67. A thermal grease that pumps out does not simply lose performance, it changes performance over the vehicle's life, which is why automotive programmes increasingly specify cycle stability rather than datasheet conductivity alone. Selecting a 3.0 W/mK grade with controlled oil bleed and proven pump-out resistance is the cheapest way to hold junction temperature margin without adding heatsink mass.

About Hanast

Shenzhen Hanast New Material Co., Ltd. has manufactured RTV-2 liquid silicone, potting compounds and thermal interface materials since 2010. With a 40,000 m² production base and 70-80% of output exported, Hanast supplies encapsulation and thermal management solutions to global B2B customers including ABB, Apple, Foxconn and BYD. The company offers OEM/ODM formulation, private labelling and full technical documentation for automotive and industrial programmes.