3.0 W/mK Thermally Conductive Silicone Potting Compound for IGBT Power Module BMS PCB Encapsulation UL94 V-0

3.0 W/mK Thermally Conductive Silicone Potting Compound for Power Electronics Encapsulation

The HN-8830A/B is a high-performance, two-component addition-cure silicone potting compound engineered for demanding power electronics applications. With an industry-leading 3.0 W/m·K thermal conductivity, it efficiently dissipates heat from IGBT modules, power semiconductors, BMS circuits, and PCB assemblies, ensuring long-term reliability under extreme thermal cycling conditions.

Key Features & Advantages

• Superior Thermal Management: 3.0 W/m·K thermal conductivity achieved through high-density aluminum oxide and aluminum nitride filler packing, outperforming standard 1.0-2.0 W/mK potting compounds.
• IGBT Power Module Optimized: Specifically formulated for IGBT, MOSFET, and SiC power module encapsulation, preventing thermal runaway in high-power switching applications.
• UL94 V-0 Flame Retardancy: Self-extinguishing formulation meets the strictest fire safety requirements for EV battery systems, charging infrastructure, and industrial power supplies.
• Excellent Electrical Insulation: Dielectric strength ≥18 kV/mm provides reliable high-voltage isolation for BMS, traction inverters, and DC-DC converters.
• Wide Operating Temperature: Maintains stable mechanical and electrical properties from -40°C to +150°C, suitable for under-hood automotive and outdoor industrial environments.
• Low Viscosity & Self-Leveling: 11,000±2,000 mPa·s viscosity enables complete penetration into tight PCB gaps and complex IGBT module geometries without air entrapment.
• RoHS & REACH Compliant: Fully compliant with EU environmental regulations for global supply chain acceptance.

Target Applications

Technical Specifications

Why Choose HanasT HN-8830A/B?

As a leading silicone potting compound manufacturer in China, Shenzhen Hanast New Material Co., Ltd. provides full OEM/ODM customization services. Our 40,000-square-meter facility with advanced thermal conductivity testers, laser particle size analyzers, and high-voltage dielectric strength testers ensures consistent batch-to-batch quality. We offer free samples for customer evaluation, custom formulation adjustments for specific viscosity, hardness, or thermal conductivity requirements, and comprehensive MSDS/TDS documentation with every shipment. Contact our engineering team today to discuss your IGBT potting, BMS encapsulation, or PCB potting project requirements.