2026-10-28
Buyers comparing RTV-2 silicone quotations often ask why one supplier quotes a 1:1 system and another a 10:1 system at a similar price. The ratio is not an arbitrary house style. It tells you which cure chemistry is inside the drum, and that chemistry determines curing speed in thick sections, tolerance to substrate contamination, what by-products are released, how precisely the operator must measure, and whether the material can be used in a sealed electronic enclosure at all.
Understanding the two families is the fastest way to avoid a costly specification mistake.
RTV-2 (two-component room-temperature-vulcanising) silicone is supplied as part A (base polymer with filler and, in some systems, catalyst) and part B (crosslinker and catalyst package). The ratio refers to the mixing weight or volume ratio of A to B.
Both are genuine RTV-2 silicones and both are used in electronics, but they behave very differently in production.
| Property | 1:1 addition cure (platinum) | 10:1 condensation cure (alkoxy/tin) |
|---|---|---|
| Cure by-product | None | Alcohol or acetic acid vapour |
| Deep-section cure | Yes — cures uniformly through the mass | No — cures from the surface inward, roughly 6–10 mm per 24 h |
| Cure speed control | Heat accelerates strongly; pot life adjustable by inhibitor | Depends on ambient humidity and section thickness |
| Mix ratio tolerance | ±5 % typically acceptable; off-ratio leaves tacky surface or soft core | More forgiving on ratio, but catalyst-rich part B must be dispersed evenly |
| Substrate inhibition risk | High — sulphur, tin, amine, some fluxes and epoxy/urethane residues poison the catalyst | Low — generally tolerant of most substrates |
| Corrosion risk to copper/silver | None | Acetic systems can corrode; alkoxy systems are much safer |
| Adhesion (unprimed) | Low to moderate; primers usually needed | Generally better on glass, ceramic and many plastics |
| Thermal range | −55 to +200 °C (up to 250 °C short-term) | −50 to +200 °C |
| Shrinkage on cure | < 0.1 % | 0.3–0.8 % (by-product loss) |
| Transparency / optical use | Excellent — no volatiles to fog lenses | Volatiles can fog optical surfaces |
| Cost per kg (typical) | Higher (platinum) | Lower |
| Metering equipment | 1:1 meter-mix, static mixer, cartridges | 10:1 meter-mix, requires accurate low-ratio pump |
| Application | Recommended chemistry | Reason |
|---|---|---|
| PCBA potting / glob top | 1:1 addition cure | No by-product, deep cure, no corrosion |
| Silicone gel for sensitive electronics | 1:1 addition cure | Low modulus, no shrinkage stress |
| LED and optical module encapsulation | 1:1 addition cure | Non-fogging, optically clear |
| EV battery and power module potting | 1:1 addition cure (thermally conductive) | Thick section cure, thermal cycling stability |
| Mould making, tooling, prototyping | 10:1 condensation cure | Low cost, good unprimed release |
| Form-in-place gasket / seam seal | 10:1 condensation cure | Thin section, humidity cure, cheap |
| Bonding to glass or ceramics | 10:1 condensation (alkoxy) | Better unprimed adhesion |
Is 1:1 always better than 10:1?
For potting electronics in sealed enclosures, almost always yes. For gasketing, bonding and mould making, 10:1 is often the more economical and more practical choice.
Can I use a 10:1 product for PCBA potting if I vent the housing?
Only for thin sections and with an alkoxy (alcohol) system. Deep sections will not cure fully and acid-cure systems should never be used on copper.
Why did my 1:1 silicone stay sticky?
Cure inhibition, an off-ratio mix, or expired part B. Check gloves and nearby tin-catalysed products first — inhibition is far more common than a bad batch.
Does mix ratio affect hardness?
Yes, within limits. Excess part B in a condensation system can plasticise the cured rubber; in an addition system, off-ratio typically causes tackiness or a soft core rather than a harder product.
The ratio printed on the label is the clearest single indicator of what a silicone will do in your process. Choose 1:1 addition cure when you need deep, by-product-free, reproducible encapsulation with long-term thermal stability; choose 10:1 condensation cure when you need economical bonding, sealing and thin-section protection on difficult substrates. Then control contamination and mix accuracy accordingly.
We supply both chemistries — 1:1 platinum-catalysed potting compounds and gels for electronics, and 10:1 alkoxy systems for sealing and bonding — and can run a substrate cure test with your housing material before you commit to a specification.