1:1 Mix Ratio Silicone Potting Compound with Deep-Section Curing and UL 94 V-0 Flame Retardancy for Thermally Conductive Potting Silicone

Two-Component Thermally Conductive Silicone Potting Compound for PCB, Power Modules and Battery Packs

Hanast HN-8806A/B is a two-component platinum-catalysed addition-cure silicone potting compound that cures at room temperature or under heat into a grey, 45 ± 5 Shore A elastomer. It combines thermal conductivity of 0.76 W/m·K or above, UL 94 V-0 flame retardancy and 1.0 × 10¹⁶ Ω·cm volume resistivity in one system, so power devices are cooled, insulated and mechanically protected in a single potting step. The compound cures with no exotherm and no by-products, keeps its elasticity from -50 °C to 250 °C, and cures through deep sections without internal voids, which matters for thick power modules, battery packs and potted transformers.

Key Features

• Thermal Conductivity 0.76 W/m·K or Above - moves heat from power modules, battery cells, LED drivers and transformers into the housing, lowering junction temperature and extending service life.
• UL 94 V-0 Flame Retardancy - meets the highest UL flammability class for consumer electronics, automotive and industrial equipment.
• Electrical Insulation 1.0 × 10¹⁶ Ω·cm with 25-30 kV/mm Dielectric Strength - protects dense circuits and high-voltage parts from creepage and short circuits.
• Wide Service Range -50 °C to 250 °C - remains flexible through thermal cycling, winter transport and high-temperature operation.
• Deep-Section Curing - full cure through thick cross-sections with no exothermic peak and no by-product release, so sealed components are not stressed or corroded.
• Extremely Low Cure Shrinkage - near-zero shrinkage avoids internal stress on delicate leads, sensors and bond wires.
• 1:1 Mix Ratio by Weight with 18-24 min Pot Life - suits dual-pump dispensing and manual potting alike.
• Dual Curing Mode - 2-3 h at 25 °C for large cavities, or 12 min at 80 °C for production lines.
• RoHS Compliant and Non-Corrosive - no corrosion to copper, aluminium or plated parts, suitable for EU and North American markets.

Technical Specifications (HN-8806A/B)

Thermal conductivity is tested to GB/T 10297-1998 at 0.76 W/m·K or above; a 1.0 W/m·K high-conductivity grade is available on request for higher heat-flux designs.

Typical Applications

• Power electronics - power module, IGBT module, solar inverter, DC-DC converter and motor driver potting.
• Battery systems - battery pack cell potting, module encapsulation, BMS board protection and thermal interface filling.
• PCB and control boards - PCB potting, circuit board impregnation, conformal encapsulation of controllers and relays.
• Sensors - temperature, pressure, Hall and current sensor encapsulation where thermal and moisture protection are both required.
• Power supply and adapters - LED driver, fast-charging adapter, EV charger module and switching power supply potting.
• Transformers and insulators - high-voltage transformer, ignition coil and insulator sealing.

Mixing and Potting Process

1. Pre-mix: stir Components A and B separately before use, because fillers settle during storage; reseal containers tightly after use.
2. Weighing: weigh A and B at exactly 1:1 by weight on a precision electronic scale.
3. Mixing: mix in one direction for a uniform blend and scrape the container walls and bottom; uneven mixing causes local incomplete cure.
4. Degassing (optional): vacuum degas for void-sensitive devices to remove air introduced during mixing.
5. Pouring / potting: pour into the clean, dry device within the 18-24 min pot life and ensure full coverage of the component.
6. Curing: cure 2-3 h at 25 °C, or 12 min at 80 °C for heat-accelerated lines; do not move or stress the part during cure.

Cure Inhibition Precautions

• This addition-cure silicone may fail to cure in contact with organotin and tin-containing silicones, sulfur and polysulfide compounds, amines, polyurethane rubber, ammonia-containing items, phosphorus compounds, organic acids and solder flux residues.
• Do not mix or use in contact with condensation-cure (acetoxy) silicone, epoxy resin or polyurethane, which cause cure inhibition.
• Clean and dry all substrates, tools and containers before potting; use nitrile gloves, goggles and adequate ventilation.
• Keep containers tightly sealed when not in use and store away from food, children and incompatible materials.

Packaging, Storage and Shelf Life

• Component A: 25 kg plastic barrel; Component B: 25 kg plastic barrel; kit 50 kg per set.
• Store in original tightly sealed containers in a cool, dry, well-ventilated area at a recommended 25 °C, protected from direct sunlight, moisture and extreme temperatures.
• Shelf life 6 months from date of manufacture when stored as recommended; inspect and test material past shelf life before use.
• Classified as non-dangerous goods for transport; handle with care to prevent leakage.

Frequently Asked Questions

About Hanast

Shenzhen Hanast New Materials Co., Ltd. manufactures liquid silicone materials at a production base in Guangdong, China, supplying addition-cure (platinum) and condensation-cure silicone for electronic potting, thermal management and mould making. Every lot ships with TDS and MSDS documentation and is compliant with RoHS and UL 94 V-0 requirements.