22 kV/mm Dielectric Strength Epoxy Potting Compound with 5:1 Mix Ratio for Aerospace Electronic Module Encapsulation

22 kV/mm Epoxy Potting Compound 5:1 High Dielectric Strength Resin for Aerospace Electronic Module Encapsulation

HN-5508AB is a two-component epoxy potting compound with a 5:1 mix ratio, specially formulated for aerospace electronic module encapsulation, avionics circuit protection and high-voltage component insulation. Based on thermosetting epoxy resin, it reacts with the curing agent to form a robust and durable insulator with excellent insulation properties, chemical resistance, high mechanical strength and strong adhesion. With dielectric strength up to 22 kV/mm, it provides reliable insulation, moisture protection, dustproofing, waterproofing and physical fixing for electronic components operating in demanding aerospace and harsh-environment applications.

Key Features

• Aerospace-grade reliability: high mechanical strength and adhesion for electronic products requiring resistance to harsh environments, vibration and thermal cycling.
• High dielectric strength: 22 kV/mm insulation rating protects high-voltage aerospace electronic modules from arcing and breakdown.
• Waterproof & moisture-proof: water absorption below 0.03% (25℃*24h) seals modules against humidity, condensation and dust.
• Wide temperature range: stable performance from -30℃ to 130-150℃ for avionics thermal environments.
• Chemical resistance: cured material resists chemical corrosion, moisture and air aging.
• 5:1 two-component system: simple mix ratio, low viscosity and long operation time compatible with automatic dispensing lines.
• ROHS & SGS compliant: meets environmental requirements for electronics and aerospace supply chains.

Technical Parameters

Applications

Aerospace electronic modules, avionics systems, capacitors, transformers, sensors, LED modules, circuit boards and other electronic products requiring high dielectric strength, high mechanical strength and resistance to harsh environments.
Customization and OEM/ODM supported. Contact us for free samples.

Why Choose HN-5508 A/B

With high hardness, high dielectric strength, low shrinkage and a low-void, vacuum-degassing-friendly cure, HN-5508 A/B is one of the best potting compounds for reliable electronics and medical device protection. Hanast is a direct manufacturer based in Shenzhen, Guangdong, China, with a dedicated R&D laboratory. We supply free samples and wholesale bulk epoxy encapsulant across Asia and worldwide at factory-direct pricing, and offer custom OEM/ODM formulation of colour, viscosity, pot life, hardness and cure speed to match your specific medical device, power module, ECU or sensor design.

Packaging & Storage

Supplied as Component A (25 kg plastic barrel) and Component B (5 kg plastic pot), or as a ready 30 kg/set kit. Store in original, tightly sealed containers in a cool, dry, well-ventilated area at around 25°C, protected from direct sunlight, moisture and extreme temperatures. Shelf life is 6 months from date of manufacture. Classified as non-dangerous goods for transport.

About this supplier

Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.
We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including medical devices, electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation.

FAQ

1. Q1: What is HN-5508 A/B and which applications does it suit?
   A1: HN-5508 A/B is a 5:1 two-component electronics grade epoxy potting compound with high hardness (Shore D 85-95) and high dielectric strength, designed for medical device electronics as well as power modules, automotive ECU modules, transformers, sensors and other high-reliability electronics.
2. Q2: Is it suitable for medical device and biocompatible (ISO 10993) applications?
   A2: It is formulated for electronics-grade, medical device encapsulation and is positioned for biocompatibility (ISO 10993) requirements. Please contact us to confirm the exact compliance documentation required for your specific medical application.
3. Q3: What are the mix ratio and curing schedule?
   A3: Mix Component A and Component B at a 5:1 ratio by weight. Pot life is 2-3 hours at 25°C (100 g mix); tack-free in 6-8 hours and fully cured in 12-16 hours at 25°C, or in 1.5-2 hours at 60-80°C when curing time needs to be optimized.
4. Q4: Can it be vacuum-degassed, and what is the insulation and shrinkage performance?
   A4: Yes, it can be vacuum-degassed to remove air for void-free potting. It offers high dielectric strength of 20-22 kV/mm, volume resistivity of 1.1 x 10¹⁵ ohm.cm and low shrinkage of 0.35-0.55% for dimensionally stable insulation.
5. Q5: Do you offer samples, customization and wholesale supply?
   A5: Yes. We are a direct China manufacturer offering free samples and wholesale bulk supply at factory-direct pricing, with custom OEM/ODM formulation of colour, viscosity, pot life, hardness and cure speed. MOQ is 1 kg in 25 kg (A) + 5 kg (B) 30 kg/set kits; samples ship in 3-5 working days and bulk orders in 7-15 days.