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Clear Epoxy Potting Compound 2:1 Self-Leveling Low Viscosity AB Glue for Narrow Gap Electronic Component Encapsulation

Clear Epoxy Potting Compound 2:1 Self-Leveling Low Viscosity AB Glue for Narrow Gap Electronic Component Encapsulation

Product Details:
Place of Origin: Guangdong, China
Brand Name: Hanast
Certification: RoHS, SGS
Model Number: HN-5506A/B
Detail Information
Place of Origin:
Guangdong, China
Brand Name:
Hanast
Certification:
RoHS, SGS
Model Number:
HN-5506A/B
Model:
HN-5506A/B
Mix Ratio (A:B):
2:1 By Weight
Color:
Transparent
Viscosity:
Low Viscosity, Excellent Flowability, Self-leveling
Hardness:
70-75 Shore D
Curing Time At 25℃:
12-24 Hours
Thermal Conductivity:
0.2-0.3 W/m·K
Temperature Resistance:
-40℃ To 120℃
Anti-yellowing:
Yes, Suitable For Prolonged Light Exposure
Shelf Life:
6 Months In Sealed Original Containers
Highlight:

High Light

Highlight:

Low Viscosity Epoxy Potting Narrow Gap

,

Clear Self-Leveling 2:1 AB Glue

,

Fine Gap Electronic Encapsulant Resin

Trading Information
Minimum Order Quantity:
1 kg
Packaging Details:
25 kg/barrel
Delivery Time:
5-7 working days
Payment Terms:
T/T
Supply Ability:
50000 kg per month
Product Description

Clear Epoxy Potting Compound 2:1 Self-Leveling Low Viscosity AB Glue for Narrow Gap Electronic Component Encapsulation

HN-5506A/B is a clear two-component epoxy potting compound with a 2:1 mix ratio, specially formulated for narrow gap and fine clearance encapsulation of electronic components. After mixing it exhibits excellent flowability and low viscosity, allowing it to easily penetrate into the minute gaps between components, coils and PCB traces before curing into a rigid, crystal-clear protective layer with high hardness and outstanding electrical insulation.

Key Features

  • Low viscosity & excellent flowability: penetrates narrow gaps, fine clearances and dense component layouts without voids.
  • 2:1 two-component system: simple mix ratio and self-leveling flow compatible with automatic dispensing lines.
  • High transparency: crystal-clear cured body enables visual inspection of components and wire bonds after potting.
  • High hardness: rigid 70-75 Shore D cured layer protects precision components against vibration and shock.
  • Excellent insulation: prevents current leakage and short circuits in high-voltage and precision electronics.
  • Anti-yellowing: maintains transparency under prolonged light exposure for LED modules and display applications.
  • Wide temperature range: stable physical and electrical properties from -40℃ to 120℃.
  • Moisture-proof & tamper-proof: seals modules against humidity while providing confidentiality protection.
  • ROHS & SGS compliant: meets environmental requirements for electronics industries.

Technical Parameters

ItemSpecification
ModelHN-5506A/B
Mix Ratio (A:B)2:1 by weight
ColorTransparent
ViscosityLow viscosity, excellent flowability, self-leveling
Hardness (Shore D)70-75
Curing Time at 25℃12-24 hours
Thermal Conductivity0.2-0.3 W/m·K
Temperature Resistance-40℃ to 120℃
Anti-yellowingYes, suitable for prolonged light exposure
Shelf Life6 months in sealed original containers

Applications

Narrow-gap electronic modules, transformers, LED modules and lighting fixtures, indicator-light components, aquarium pumps, high-voltage components, precision sensors, relays, confidentiality modules and other precision electronic devices requiring transparent high-hardness encapsulation with deep gap penetration.

Customization and OEM/ODM supported. Contact us for free samples.