HN-5506A/B is a clear two-component epoxy potting compound with a 2:1 mix ratio, specially formulated for narrow gap and fine clearance encapsulation of electronic components. After mixing it exhibits excellent flowability and low viscosity, allowing it to easily penetrate into the minute gaps between components, coils and PCB traces before curing into a rigid, crystal-clear protective layer with high hardness and outstanding electrical insulation.
| Item | Specification |
|---|---|
| Model | HN-5506A/B |
| Mix Ratio (A:B) | 2:1 by weight |
| Color | Transparent |
| Viscosity | Low viscosity, excellent flowability, self-leveling |
| Hardness (Shore D) | 70-75 |
| Curing Time at 25℃ | 12-24 hours |
| Thermal Conductivity | 0.2-0.3 W/m·K |
| Temperature Resistance | -40℃ to 120℃ |
| Anti-yellowing | Yes, suitable for prolonged light exposure |
| Shelf Life | 6 months in sealed original containers |
Narrow-gap electronic modules, transformers, LED modules and lighting fixtures, indicator-light components, aquarium pumps, high-voltage components, precision sensors, relays, confidentiality modules and other precision electronic devices requiring transparent high-hardness encapsulation with deep gap penetration.
Customization and OEM/ODM supported. Contact us for free samples.