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1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

Name: 1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant
Brand: Shenzhen Hanast New Material co.,LTD
SKU: HN-8810
Availability: InStock

Productdetails:

Plaats van herkomst:	Guangdong, China
Merknaam:	Hanast
Certificering:	ROHS
Modelnummer:	HN-8810

Gedetailleerde informatie

Plaats van herkomst:

Guangdong, China

Merknaam:

Hanast

Certificering:

ROHS

Modelnummer:

HN-8810

Naam:

Silicone-pottenverbinding voor elektronica

Mengverhouding:

1:1

Kleur:

Grijs, wit, zwart

Functies:

1,0 thermische geleidbaarheid

MOQ:

1 tot 2 kg

Brede Temperatuurwaaier:

-50°C tot 250°C

Hardheid:

50±5 Strand A

Sollicitatie:

Nieuwe energievoertuigbatterijen en thermische beheersystemen

Houdbaarheidstijd:

6 maanden

Cusomization:

Steun

Handelsinformatie

Min. bestelaantal:

1KG

Prijs:

Onderhandelbaar

Verpakking Details:

50KG/set, 25KG/bar

Levertijd:

5-7 dagen

Betalingscondities:

T/T, PayPal

Levering vermogen:

100ton/maand

Productbeschrijving

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

Product Overview for silicone potting compound:

A potting compound with a thermal conductivity of 1.0 refers to an electronically insulating potting material characterized by a thermal conductivity coefficient of 1.0. It serves as an entry-level—or foundational—high-thermal-conductivity product within the field of thermally conductive potting compounds, primarily utilized to replace traditional potting materials lacking thermal conductivity in order to satisfy basic heat dissipation and sealing requirements.

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 0

Technical Parameters for silicone potting compound:

Exterior:grey liquid
viscosity:2000-3000cps
hardness:45-50shore A
thermal conducitivity:1.0(W/M▪K)
Flame retardant rating (V) (UL94):V-0

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 1

Product Applications for silicone potting compound:

LED Drivers: Protect circuit boards from moisture while dissipating heat generated by transformers and MOSFETs. Home Appliance Controllers: Such as control modules for washing machines and refrigerators—providing moisture and vibration protection while also facilitating heat dissipation. Standard Transformers and Instrument Transformers: Minimize internal temperature rise within the coils during operation. Outdoor Lighting Fixtures: Meet IP67 standards for water and dust resistance while providing essential thermal protection.

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 2

Packaging & Storage for silicone potting compound:

Standard Packaging: Component A 25kg/drum, Component B 25kg/drum.

Store in a cool, dry place. Shelf life: 6 months.

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 3

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 4

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1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

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