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1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

Name: 1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant
Brand: Shenzhen Hanast New Material co.,LTD
SKU: HN-8810
Availability: InStock

Product Details:

Place of Origin:	Guangdong, China
Brand Name:	Hanast
Certification:	ROHS
Model Number:	HN-8810

Detail Information

Place of Origin:

Guangdong, China

Brand Name:

Hanast

Certification:

ROHS

Model Number:

HN-8810

Features:

1.0 Thermal Conductivity

Name:

Silicone Potting Compound For Electronics

Mix Ratio:

1:1

Color:

Grey,white,black

MOQ:

1-2KG

Wide Temperature Range:

-50°C To 250°C

Hardness:

50±5 SHORE A

Application:

New Energy Vehicle Power Batteries And Thermal Management Systems

Shelf Time:

6months

Cusomization:

Support

Trading Information

Minimum Order Quantity:

1KG

Price:

Negotiable

Packaging Details:

50KG/set, 25KG/bar

Delivery Time:

5-7days

Payment Terms:

T/T、paypal

Supply Ability:

100ton/month

Product Description

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

Product Overview for silicone potting compound:

A potting compound with a thermal conductivity of 1.0 refers to an electronically insulating potting material characterized by a thermal conductivity coefficient of 1.0. It serves as an entry-level—or foundational—high-thermal-conductivity product within the field of thermally conductive potting compounds, primarily utilized to replace traditional potting materials lacking thermal conductivity in order to satisfy basic heat dissipation and sealing requirements.

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 0

Technical Parameters for silicone potting compound:

Exterior:grey liquid
viscosity:2000-3000cps
hardness:45-50shore A
thermal conducitivity:1.0(W/M▪K)
Flame retardant rating (V) (UL94):V-0

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 1

Product Applications for silicone potting compound:

LED Drivers: Protect circuit boards from moisture while dissipating heat generated by transformers and MOSFETs. Home Appliance Controllers: Such as control modules for washing machines and refrigerators—providing moisture and vibration protection while also facilitating heat dissipation. Standard Transformers and Instrument Transformers: Minimize internal temperature rise within the coils during operation. Outdoor Lighting Fixtures: Meet IP67 standards for water and dust resistance while providing essential thermal protection.

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 2

Packaging & Storage for silicone potting compound:

Standard Packaging: Component A 25kg/drum, Component B 25kg/drum.

Store in a cool, dry place. Shelf life: 6 months.

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 3

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 4

Tags:

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

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