Zu Hause > produits >

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

Name: 1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant
Brand: Shenzhen Hanast New Material co.,LTD
SKU: HN-8810
Availability: InStock

Produktdetails:

Herkunftsort:	Guangdong, China
Markenname:	Hanast
Zertifizierung:	ROHS
Modellnummer:	HN-8810

Einzelheiten

Herkunftsort:

Guangdong, China

Markenname:

Hanast

Zertifizierung:

ROHS

Modellnummer:

HN-8810

Name:

Silikon-Potting-Verbindung für Elektronik

Mix -Verhältnis:

1:1

Farbe:

Grau, weiß, schwarz

Merkmale:

1,0 Wärmeleitfähigkeit

Mindestbestellmenge:

1 bis 2 kg

Breite Temperaturspanne:

-50 °C bis 250 °C

Härte:

50±5 Ufer A

Anwendung:

Neue Energiefahrzeugbatterien und Wärmemanagementsysteme

Haltbarkeitsdauer:

6 Monate

Cusomization:

Unterstützung

Handelsinformationen

Min Bestellmenge:

1 kg

Preis:

Verhandlungsfähig

Verpackung Informationen:

50 kg/Satz, 25 kg/Stange

Lieferzeit:

5-7 Tage

Zahlungsbedingungen:

T/T, PayPal

Versorgungsmaterial-Fähigkeit:

100 Tonnen/Monat

Beschreibung des Produkts

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

Product Overview for silicone potting compound:

A potting compound with a thermal conductivity of 1.0 refers to an electronically insulating potting material characterized by a thermal conductivity coefficient of 1.0. It serves as an entry-level—or foundational—high-thermal-conductivity product within the field of thermally conductive potting compounds, primarily utilized to replace traditional potting materials lacking thermal conductivity in order to satisfy basic heat dissipation and sealing requirements.

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 0

Technical Parameters for silicone potting compound:

Exterior:grey liquid
viscosity:2000-3000cps
hardness:45-50shore A
thermal conducitivity:1.0(W/M▪K)
Flame retardant rating (V) (UL94):V-0

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 1

Product Applications for silicone potting compound:

LED Drivers: Protect circuit boards from moisture while dissipating heat generated by transformers and MOSFETs. Home Appliance Controllers: Such as control modules for washing machines and refrigerators—providing moisture and vibration protection while also facilitating heat dissipation. Standard Transformers and Instrument Transformers: Minimize internal temperature rise within the coils during operation. Outdoor Lighting Fixtures: Meet IP67 standards for water and dust resistance while providing essential thermal protection.

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 2

Packaging & Storage for silicone potting compound:

Standard Packaging: Component A 25kg/drum, Component B 25kg/drum.

Store in a cool, dry place. Shelf life: 6 months.

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 3

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 4

Tags:

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

Silikongel für die Pflege von Töpfen,

Gummi-Potting-Verbindung,

RTV-Köpferei

Wärmeleitfähigkeit Elektronisches Potting Silicone Flüssigkeit Zwei Komponenten Custom

Feuchtigkeitsbeständiges AB-Silikon-Vergussmasse-Gummi-Rohmaterial für elektronische Geräte

Wasserdichte RTV-Potting-Verbindung Silikongel-Material hohe Wärmeleitfähigkeit Rtv-Silicone-Potting-Verbindung

55 Shore Eine Silikon-Potting-Verbindung für Elektronik Kleber Klebstoff 1:1 2 Teile Wärmeleitende Potting

ODM Flexible Electronic Potting Silicone Gummi-Dichtungsmittel Rohstoff 1:1

OEM Gummi Silicone Potting Compound Flexible Wärmeleitfähigkeit Flammschutz Elektronische Komponenten

Flexibles Silikon-Elektronik-Potting-Gel-Material für elektronische Komponenten