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1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

Détails du produit:
Lieu d'origine: Guangdong, Chine
Nom de marque: Hanast
Certification: ROHS
Numéro de modèle: HN-8810
Informations détaillées
Lieu d'origine:
Guangdong, Chine
Nom de marque:
Hanast
Certification:
ROHS
Numéro de modèle:
HN-8810
Nom:
Composé de silicone pour les appareils électroniques
Ratio de mélange:
1:1
Couleur:
Gris, blanc, noir
Caractéristiques:
1,0 conductivité thermique
MOQ:
1 à 2 kg
Température ambiante large:
-50°C à 250°C
Dureté:
50 ± 5 côte A
Application:
Batteries d’alimentation pour véhicules à énergie nouvelle et systèmes de gestion thermique
Durée de conservation:
6 mois
Cusomization:
Soutien
Informations commerciales
Quantité de commande min:
1KG
Prix:
Négociable
Détails d'emballage:
50 kg/ensemble, 25 kg/barre
Délai de livraison:
5-7 jours
Conditions de paiement:
T/T、paypal
Capacité d'approvisionnement:
100 tonnes/mois
Description du produit

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

 

 

Product Overview for silicone potting compound:

A potting compound with a thermal conductivity of 1.0 refers to an electronically insulating potting material characterized by a thermal conductivity coefficient of 1.0. It serves as an entry-level—or foundational—high-thermal-conductivity product within the field of thermally conductive potting compounds, primarily utilized to replace traditional potting materials lacking thermal conductivity in order to satisfy basic heat dissipation and sealing requirements.

 

 

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 0

 

Technical Parameters for silicone potting compound:

Exterior:grey liquid
viscosity:2000-3000cps
hardness:45-50shore A
thermal conducitivity:1.0(W/M▪K)
Flame retardant rating (V) (UL94):V-0
 

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 1

 

Product Applications for silicone potting compound:

LED Drivers: Protect circuit boards from moisture while dissipating heat generated by transformers and MOSFETs. Home Appliance Controllers: Such as control modules for washing machines and refrigerators—providing moisture and vibration protection while also facilitating heat dissipation. Standard Transformers and Instrument Transformers: Minimize internal temperature rise within the coils during operation. Outdoor Lighting Fixtures: Meet IP67 standards for water and dust resistance while providing essential thermal protection.

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 2

 

 

 

 

 

 

Packaging & Storage for silicone potting compound:

Standard Packaging: Component A 25kg/drum, Component B 25kg/drum.

Store in a cool, dry place. Shelf life: 6 months.

 

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 3

 

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