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1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

Detalhes do produto:
Lugar de origem: Cantão, China
Marca: Hanast
Certificação: ROHS
Número do modelo: HN-8810
Informações pormenorizadas
Lugar de origem:
Cantão, China
Marca:
Hanast
Certificação:
ROHS
Número do modelo:
HN-8810
Nome:
Composto de silicone para eletrônicos
Mix Ratio:
1:1
Cor:
Cinza, branco, preto
Características:
1,0 condutividade térmica
Quantidade mínima:
1 a 2 kg
Variação da temperatura larga:
-50°C a 250°C
Dureza:
50±5 Costa A
Aplicativo:
Novas baterias de energia para veículos e sistemas de gerenciamento térmico
Prazo de validade:
6 meses
Cusomization:
Apoiar
Informações de negociação
Quantidade de ordem mínima:
1kg
Preço:
Negociável
Detalhes da embalagem:
50kg/conjunto, 25kg/barra
Tempo de entrega:
5-7 dias
Termos de pagamento:
T/T、paypal
Habilidade da fonte:
100 toneladas/mês
Descrição do produto

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

 

 

Product Overview for silicone potting compound:

A potting compound with a thermal conductivity of 1.0 refers to an electronically insulating potting material characterized by a thermal conductivity coefficient of 1.0. It serves as an entry-level—or foundational—high-thermal-conductivity product within the field of thermally conductive potting compounds, primarily utilized to replace traditional potting materials lacking thermal conductivity in order to satisfy basic heat dissipation and sealing requirements.

 

 

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 0

 

Technical Parameters for silicone potting compound:

Exterior:grey liquid
viscosity:2000-3000cps
hardness:45-50shore A
thermal conducitivity:1.0(W/M▪K)
Flame retardant rating (V) (UL94):V-0
 

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 1

 

Product Applications for silicone potting compound:

LED Drivers: Protect circuit boards from moisture while dissipating heat generated by transformers and MOSFETs. Home Appliance Controllers: Such as control modules for washing machines and refrigerators—providing moisture and vibration protection while also facilitating heat dissipation. Standard Transformers and Instrument Transformers: Minimize internal temperature rise within the coils during operation. Outdoor Lighting Fixtures: Meet IP67 standards for water and dust resistance while providing essential thermal protection.

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Packaging & Storage for silicone potting compound:

Standard Packaging: Component A 25kg/drum, Component B 25kg/drum.

Store in a cool, dry place. Shelf life: 6 months.

 

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