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1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

Name: 1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant
Brand: Shenzhen Hanast New Material co.,LTD
SKU: HN-8810
Availability: InStock

Detail Produk:

Tempat asal:	Guangdong, Tiongkok
Nama merek:	Hanast
Sertifikasi:	ROHS
Nomor model:	HN-8810

Informasi Rinci

Tempat asal:

Guangdong, Tiongkok

Nama merek:

Hanast

Sertifikasi:

ROHS

Nomor model:

HN-8810

Nama:

Silikon Potting Compound Untuk Elektronik

Rasio campuran:

1:1

Warna:

Abu-abu, Putih, Hitam

Fitur:

1,0 konduktivitas termal

MOQ:

1-2Kg

Kisaran suhu yang luas:

-50°C Hingga 250°C

Kekerasan:

50 ± 5 pantai a

Aplikasi:

Baterai Tenaga Kendaraan Energi Baru dan Sistem Manajemen Termal

Waktu Rak:

6 bulan

Kustomisasi:

Mendukung

Informasi Perdagangan

Kuantitas min Order:

1KG

Harga:

Dapat dinegosiasikan

Kemasan rincian:

50KG/set, 25KG/batang

Waktu pengiriman:

5-7 hari

Syarat-syarat pembayaran:

T/T,paypal

Menyediakan kemampuan:

100ton/bulan

Deskripsi Produk

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

Product Overview for silicone potting compound:

A potting compound with a thermal conductivity of 1.0 refers to an electronically insulating potting material characterized by a thermal conductivity coefficient of 1.0. It serves as an entry-level—or foundational—high-thermal-conductivity product within the field of thermally conductive potting compounds, primarily utilized to replace traditional potting materials lacking thermal conductivity in order to satisfy basic heat dissipation and sealing requirements.

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 0

Technical Parameters for silicone potting compound:

Exterior:grey liquid
viscosity:2000-3000cps
hardness:45-50shore A
thermal conducitivity:1.0(W/M▪K)
Flame retardant rating (V) (UL94):V-0

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 1

Product Applications for silicone potting compound:

LED Drivers: Protect circuit boards from moisture while dissipating heat generated by transformers and MOSFETs. Home Appliance Controllers: Such as control modules for washing machines and refrigerators—providing moisture and vibration protection while also facilitating heat dissipation. Standard Transformers and Instrument Transformers: Minimize internal temperature rise within the coils during operation. Outdoor Lighting Fixtures: Meet IP67 standards for water and dust resistance while providing essential thermal protection.

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 2

Packaging & Storage for silicone potting compound:

Standard Packaging: Component A 25kg/drum, Component B 25kg/drum.

Store in a cool, dry place. Shelf life: 6 months.

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 3

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 4

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1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

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