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1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

Ürün detayları:
Menşe yeri: Guangdong, Çin
Marka adı: Hanast
Sertifika: ROHS
Model numarası: HN-8810
Ayrıntılı Bilgiler
Menşe yeri:
Guangdong, Çin
Marka adı:
Hanast
Sertifika:
ROHS
Model numarası:
HN-8810
İsim:
Elektronik için silikon kaplama bileşiği
Karışım oranı:
1:1
Renk:
Gri, Beyaz, Siyah
Özellikler:
1.0 termal iletkenlik
Adedi:
1-2Kg
Geniş sıcaklık aralığı:
-50°C ila 250°C
Sertlik:
50 ± 5 kıyı a
Başvuru:
Yeni Enerji Araç Güç Aküleri ve Termal Yönetim Sistemleri
Raf Süresi:
6 ay
özelleştirme:
Destek
Ticaret Bilgisi
Min sipariş miktarı:
1kg
Fiyat:
Anlaşılabilir
Ambalaj bilgileri:
50KG/takım, 25KG/bar
Teslim süresi:
5-7Gün
Ödeme koşulları:
Banka havalesi, paypal
Yetenek temini:
100ton/ay
Ürün Tanımı

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant

 

 

Product Overview for silicone potting compound:

A potting compound with a thermal conductivity of 1.0 refers to an electronically insulating potting material characterized by a thermal conductivity coefficient of 1.0. It serves as an entry-level—or foundational—high-thermal-conductivity product within the field of thermally conductive potting compounds, primarily utilized to replace traditional potting materials lacking thermal conductivity in order to satisfy basic heat dissipation and sealing requirements.

 

 

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 0

 

Technical Parameters for silicone potting compound:

Exterior:grey liquid
viscosity:2000-3000cps
hardness:45-50shore A
thermal conducitivity:1.0(W/M▪K)
Flame retardant rating (V) (UL94):V-0
 

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 1

 

Product Applications for silicone potting compound:

LED Drivers: Protect circuit boards from moisture while dissipating heat generated by transformers and MOSFETs. Home Appliance Controllers: Such as control modules for washing machines and refrigerators—providing moisture and vibration protection while also facilitating heat dissipation. Standard Transformers and Instrument Transformers: Minimize internal temperature rise within the coils during operation. Outdoor Lighting Fixtures: Meet IP67 standards for water and dust resistance while providing essential thermal protection.

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Packaging & Storage for silicone potting compound:

Standard Packaging: Component A 25kg/drum, Component B 25kg/drum.

Store in a cool, dry place. Shelf life: 6 months.

 

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 3

 

1.0 W/M·K Thermal Potting Compound for Power Supplies and Electronics– High Performance Silicone Encapsulant 4