Low Viscosity RTV Silicone Potting Compound Two Component 1:1 for IGBT Power Module Charging Pile Encapsulation

Product Overview

HN-8806 is a low-viscosity RTV two-component 1:1 addition cure silicone potting compound specifically developed for IGBT power module encapsulation and EV charging pile electronics protection. With its 4500-5000 mPa·s flowability, it penetrates densely packed PCB assemblies and under-fills tall components with ease — ideal for high-voltage power modules, fast-charging adapters, and battery pack sealing. Delivers 0.76 W/m·K thermal conductivity, UL 94 V-0 flame retardancy, and 18-25 kV/mm dielectric strength for demanding power electronics applications. RoHS and REACH compliant with factory-direct bulk supply available.

Key Features for IGBT & Charging Pile Applications

• ✅ 4500-5000 mPa·s Low Viscosity — Superior flowability for complete PCB penetration around IGBT modules, transformers, and dense SMD assemblies without trapped air pockets
• ✅ 0.76 W/m·K Thermal Conductivity — Reliable heat dissipation from IGBT power semiconductors and high-frequency transformers in fast-charging stations
• ✅ 18-25 kV/mm Dielectric Strength — Critical high-voltage insulation for 800V EV charging architectures and high-voltage power modules
• ✅ UL 94 V-0 Flame Retardant — Mandatory safety compliance for public EV charging infrastructure installed in parking structures and commercial buildings
• ✅ 1:1 Mix Ratio with 0.3-0.4 hr Pot Life — Optimized working time for manual and automated potting of large charging pile power modules
• ✅ -50°C to 250°C Temperature Range — Stable performance from arctic winter charging stations to desert solar-powered charging hubs
• ✅ Low Shrinkage & Non-Corrosive — Zero stress on IGBT wire bonds and sensitive power semiconductor junctions during cure
• ✅ Deep Section Curing — Uniform cure through thick potting sections in high-voltage transformer and inductor assemblies

Technical Specifications

Target Applications

How to Use — Application Guide

1. Surface Preparation: Clean the IGBT module or PCB substrate thoroughly. Ensure surfaces are free of oil, dust, and moisture for optimal adhesion.
2. Mixing: Weigh Part A and Part B at 1:1 ratio. Mix thoroughly for 2-3 minutes with a clean stirring tool until uniform grey color is achieved.
3. Vacuum Degassing (Recommended): For high-voltage IGBT modules, vacuum degas the mixed compound for 5-10 minutes to eliminate entrapped air bubbles.
4. Potting: Pour the mixed compound slowly into the housing, allowing the low-viscosity material to flow around and under components. For large power modules, potting in stages is recommended.
5. Curing: Room temperature cure: 4-12 hours. Heat-accelerated cure: approximately 12 minutes at 80°C for high-throughput production lines.
6. Automated Production: Use a metering pump with static mixer for continuous dispensing. Pre-vacuum Part A and Part B separately before pumping for bubble-free results.

Packaging & Supply

Standard packaging: 20kg/drum and 200kg/drum with export-grade moisture-proof inner lining. MOQ: 20 kg. Monthly capacity: 50,000 kg from our 40,000 sqm manufacturing base in Guangdong, China. Shelf life: 6 months in cool, dry storage at room temperature. Non-toxic, non-dangerous goods shipped under general chemical handling. MSDS and TDS certificates provided with every order. Contact us for volume pricing, custom viscosity adjustments, and free evaluation samples.