Low Viscosity Thermally Conductive Epoxy Potting Compound with Shore D 85-95 Hardness for Power Module Encapsulation

HANAST HN-5508 A/B Low Viscosity Thermally Conductive Black Epoxy Potting Compound for Power Module and Automated Dispensing Encapsulation

HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compound engineered for the electronics and electrical industry. Mixed at a 5:1 ratio by weight, the low-viscosity system flows readily, delivers good fluidity and a long pot life, and penetrates deep into narrow gaps, fine windings and tight housings before curing bubble-free into a smooth, glossy, high-hardness (Shore D 85-95) black encapsulant with good thermal management and electrical insulation. It is an ideal, automation-friendly resin for potting and protecting power modules, transformers, sensors and other electronics.

Key Features

• 5:1 two-component epoxy system, room-temperature cure or 60-80°C accelerated cure
• Low viscosity and long pot life (2-3 h) with good fluidity for deep narrow-gap penetration
• Thermally conductive black encapsulant supports heat dissipation in power-dense modules
• Compatible with automatic dispensing machines and vacuum degassing for void-free potting
• High hardness Shore D 85-95 for rigid, impact-resistant component protection
• High dielectric strength of 20-22 kV/mm with volume resistivity of 1.1 x 10¹⁵ ohm.cm
• Acid/alkali resistance, moisture proofing and humid-heat ageing resistance
• High compressive strength (18-22 kg/cm²) and high bonding strength
• Cures bubble-free to a smooth, glossy surface with low shrinkage (0.35-0.55%)
• Wide service range from -30°C to a 130-150°C heat distortion temperature
• RoHS compliant and classified as non-dangerous goods for global shipment
• Factory-direct China manufacturer with custom OEM/ODM and free samples

Technical Specifications

Processing & Dispensing

Thanks to its low viscosity and long working time, HN-5508 A/B is well suited to both manual casting and automated production. Weigh A and B at 5:1 by weight, mix thoroughly, and optionally vacuum-degas to remove air for void-free results. The mixed resin remains workable for 2-3 hours, allowing reliable feeding through automatic dispensing machines for repeatable encapsulation. Curing time can be optimized for your line: parts are tack-free in 6-8 h and fully cured in 12-16 h at 25°C, or fully cured in only 1.5-2 h at 60-80°C for fast throughput.

Applications

HN-5508 A/B is widely used for potting and protection of electronic and electrical components: power supply modules, EV battery packs and BMS boards, onboard chargers, LED drivers, 5G base station power units, solar inverter modules, wind turbine converters and hydrogen fuel cell components; transformers, resistors, filters, temperature sensors, temperature controllers, industrial sensors and motor stators; high-voltage ignition coils, high-voltage packages, automotive ECU modules, PCBs, aquarium and underwater equipment, negative-ion generators and ultrasonic atomizers. It suits power-dense, sealed and harsh-environment electronics that require low-viscosity penetration, heat dissipation, insulation and long-term reliability.

Factory Direct & Custom OEM / ODM

Hanast is a direct potting compound manufacturer based in Shenzhen, Guangdong, China, with a dedicated R&D laboratory. We offer custom OEM/ODM formulation of colour, viscosity, pot life, hardness and cure speed to match your specific power module, transformer or automation line, with free samples and fast delivery. Wholesale and bulk epoxy encapsulant supply is available across Asia and worldwide at factory-direct pricing.

Packaging & Storage

Supplied as Component A (25 kg plastic barrel) and Component B (5 kg plastic pot), or as a ready 30 kg/set kit. Store in original, tightly sealed containers in a cool, dry, well-ventilated area at around 25°C, protected from direct sunlight, moisture and extreme temperatures. Shelf life is 6 months from date of manufacture. Classified as non-dangerous goods for transport.

About this supplier

Shenzhen Hanast New Material Co., Ltd. is a premier high-tech enterprise and leading source manufacturer specializing in the R&D, manufacturing, and global supply of industrial silicone materials. As a strategic branch of the renowned Shenzhen Kanglibang Technology Co., Ltd., Hanast integrates over a decade of chemical adhesive expertise with a cutting-edge 40,000-square-meter modern production base (including our newly expanding Jiangmen facility) to deliver high-capacity, reliable material solutions worldwide.

We serve as a vital tier-one supplier and OEM/ODM partner for global factories, procurement managers, and engineering teams across diverse sectors, including electric vehicles (EV), battery energy storage systems (BESS), solar inverters, LED lighting, and industrial automation.

FAQ

Q1: What is HN-5508 A/B and which applications does it suit?
A1: HN-5508 A/B is a 5:1 two-component low viscosity thermally conductive black epoxy potting compound with high hardness (Shore D 85-95) and high dielectric strength. It is designed for encapsulating power modules, transformers, sensors, EV battery packs, LED drivers and other electronics.

Q2: What are the mix ratio and curing schedule?
A2: Mix Component A and Component B at a 5:1 ratio by weight. Pot life is 2-3 hours at 25°C (100 g mix); it is tack-free in 6-8 hours and fully cured in 12-16 hours at 25°C, or in only 1.5-2 hours at 60-80°C when curing time needs to be optimized.

Q3: Is it suitable for automatic dispensing and vacuum degassing?
A3: Yes. Its low viscosity and good fluidity make it compatible with automatic dispensing machines for repeatable encapsulation, and it can be vacuum-degassed to remove air bubbles for void-free potting of narrow gaps and fine windings.

Q4: What are its thermal and electrical insulation performance?
A4: It is a thermally conductive black encapsulant for heat dissipation in power-dense modules, with high dielectric strength of 20-22 kV/mm, volume resistivity of 1.1 x 10¹⁵ ohm.cm, a 130-150°C heat distortion temperature and -30°C low-temperature resistance.

Q5: Are you a factory, and what about samples, MOQ and wholesale supply?
A5: We are a direct China manufacturer (Shenzhen, Guangdong). MOQ is 1 kg in 25 kg (A) + 5 kg (B) 30 kg/set kits; free samples ship in 3-5 working days and wholesale/bulk orders in 7-15 days, with bulk epoxy encapsulant supply available across Asia and worldwide.