Transparent Fast Curing Silicone Potting Compound HN-8808 25A ODM for IGBT Module LED Encapsulation Protection
Transparent Fast Curing Silicone Potting Compound HN-8808
HN-8808 is a transparent fast-curing two-component silicone potting compound optimized for IGBT power module encapsulation and high-voltage LED array protection. Achieves full cure in 8-12 hours at room temperature with a 1-2 hour pot life—balancing production speed with ample working time. The combination of 18-25 kV/mm dielectric strength, low 2.5-3.0 dielectric constant, and Shorre A 25 flexible stress relief makes it ideal for power semiconductor assemblies. Full ODM customization from our 40,000 m² Shenzhen facility.
Key Features
⚡ IGBT Module Optimized Insulation
Purpose-engineered for IGBT power module encapsulation where high dielectric withstand (18-25 kV/mm) and low dielectric loss (≤4×10⁻³ at 1 MHz) are critical. The low 2.5-3.0 dielectric constant minimizes parasitic capacitance and switching losses in high-frequency power conversion circuits, motor drives, and traction inverters.
⏱️ 8-12 Hour Fast Room Temp Cure
Full encapsulation cure in just 8-12 hours at ambient 25 °C—significantly faster than many competing 24+ hour formulations. This reduces work-in-progress inventory and accelerates production throughput. 1-2 hour pot life allows single-batch mixing for large or multiple IGBT module assemblies without rushing.
💡 High-Voltage LED Encapsulation
Transparent formulation enables optical clarity for LED COB modules while delivering 18-25 kV/mm insulation for high-voltage LED strings (277V, 347V, 480V systems). Non-yellowing under sustained LED heat and UV exposure. Excellent thermal dissipation through the 0.1-0.20 W/m·K pathway for LED junction temperature management.
🏭 ODM Fast-Track Production
Tailor viscosity, hardness, color, and cure profile for your IGBT or LED production line. Our 40,000 m² facility with dedicated R&D lab delivers custom formulation samples in 3-5 working days. Multi-ton batch production with rigorous ISO 9001 lot-to-lot consistency. Full MSDS and TDS documentation with every shipment.
🔬 Low Dielectric Loss Power Electronics
Dielectric loss factor of ≤ 4×10⁻³ at 1 MHz ensures minimal energy dissipation in high-frequency switching applications. Combined with 2.5-3.0 dielectric constant, this compound is ideal for SiC and GaN wide-bandgap power modules operating at frequencies above 100 kHz where dielectric heating would otherwise limit performance.
🛡️ Thermal Stress Relief for Power Modules
The soft Shore A 25 flexible gel absorbs CTE mismatch stress between copper busbars, ceramic substrates (Al₂O₃/AlN), and silicone gel encapsulant in IGBT modules. Prevents wire bond lift-off and solder fatigue during power cycling from -57°C cold-start to 250°C junction temperature excursions.
Target Applications
| Application |
Use Case |
Why HN-8808 |
| IGBT Power Modules |
Industrial motor drives, traction inverters, UPS systems, welding power supplies |
18-25 kV/mm, Dk 2.5-3.0, Df ≤4×10⁻³, 25A stress relief |
| High-Voltage LED Systems |
347V/480V LED drivers, stadium lighting, horticultural LED arrays |
Transparent, non-yellowing, 0.98 lightweight, thermal pathway |
| Power Semiconductor Packaging |
SiC MOSFET modules, GaN HEMT packages, power diode assemblies |
Low Df at 1MHz for 100kHz+ switching, wide bandgap compatible |
| Industrial Power Supplies |
High-power SMPS, railway power converters, EV charging station modules |
8-12h fast cure, 1-2h pot life, -57°C to 250°C range |
Technical Specifications
| Property |
Value |
| Appearance |
Transparent / White / Grey liquid |
| Viscosity A / B |
2000 mPa·s / 50 mPa·s |
| Specific Gravity |
0.98 |
| Hardness |
Shore A 25 (flexible gel) |
| Dielectric Strength |
18-25 kV/mm |
| Volume Resistivity |
≥1×10¹⁴ Ω·cm |
| Dielectric Constant (1MHz) |
2.5-3.0 |
| Dielectric Loss (1MHz) |
≤4×10⁻³ |
| Thermal Conductivity |
0.1-0.20 W/m·K |
| Operating Time at 25°C |
1-2 hours |
| Curing Time at 25°C |
8-12 hours |
| Temperature Range |
-57°C to 250°C |
IGBT & LED ODM Potting Solutions
Custom dielectric, thermal, and cure-speed formulations for your power module or LED application. ISO 9001 certified 40,000 m² facility. Sample batches in 3-5 working days.
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